Wireless power transfer system for simultaneous transfer to multiple devices with cross talk and interference mitigation

ABSTRACT

A dual wireless power transfer system is disclosed having an input power supply providing power at a first voltage V1 and a first wireless power transmission system receiving power at a first power input from the input power supply, the first wireless power transmission system including a first transmitter antenna and a first driver for driving the first transmitter antenna for wireless power transmission to a first wireless receiver system and wireless receipt of data from the first receiver system, wherein data wirelessly received at the first transmitter antenna from the first receiver system at least partially feeds back onto the first power input. A second wireless power transmission system includes a second transmitter antenna and a second driver for driving the second transmitter antenna for wireless power transmission to a second wireless receiver system. A low voltage drop out receives power from the input power supply at V 1  and provides power at a preselected lower voltage V 2  to the second wireless power transmission system, such that V 2  is independent of data received at the first transmitter antenna.

TECHNICAL FIELD

The present disclosure generally relates to systems, apparatus, andmethods for wireless power transfer and, more particularly, to systems,methods, and apparatus for simultaneous wireless power transfer tomultiple devices.

BACKGROUND

A challenge with wireless power transfer involves a transmitting elementbeing able to generate a sufficiently high concentration of magneticfield flux to reach a receiving element at a particular distance away.

Inductive wireless power transfer occurs when magnetic fields created bya transmitting element induce an electric field, and hence electriccurrent, in a receiving element. These transmitting and receivingelements will often take forms of coils of wire. The amount of powerthat is transferred wirelessly depends on mutual inductance, which is afunction of transmitter inductance, receiver inductance, and coupling.Coupling is measured in terms of a coupling coefficient (“k”), whichquantifies how much magnetic field is captured by a receiver coil.

Coupling will decrease when distance increases between a transmittingelement and a receiving element. This leads to lower mutual inductance,and less power transfer. This effect can be counteracted by increasingtransmitter inductance and/or receiver inductance. One disadvantage isthat doing so causes equivalent series resistance (ESR) to increase,which leads to more heat and greater energy losses.

When designing present-day systems, electronics and magnetics designersmust make trade-offs, since designs which transmit power effectively atlarger distances usually create greater electromagnetic interference(EMI) and higher heat levels. Moreover, components of an electricalsystem can be damaged or forced to shut down if heat levels riseexcessively. Excess heat can also degrade battery life.

Examples of situations where longer-distance wireless power transferwould be helpful include harsh environments where sizable housings orbarriers must be placed around equipment, thereby preventing atransmitting coil and a receiving coil from being positioned near to oneanother. Other, similar examples include situations whereaccessories—such as a hand strap, a phone cover, a card holder, a case,a vehicle mount, a personal electronic device accessory, a phone grip,and/or a stylus holder—must be positioned between a transmitting coiland a receiving coil.

Longer-distance wireless power transfer is often also limited by thedesign of the device being charged, the design of the charging system,or both in combination. For example, the size and number of devicesrequiring charging may not allow for longer-distance charging. Likewise,the size and design of the charging system may pre-determine a maximumcharging distance for a device, which is less than the distance neededby the device to be charged. Present-day charging systems which requiredevices be placed within a charging bay, or in contact with the chargingbay, may preclude charging over-sized devices. Even multiple devicecharging systems (e.g., a multi-bay system having multiple bays formultiple devices) have left this issue unresolved. An example where sizeand number of devices needing re-charge matter, and where bay ormultiple device charging systems are needed, is in industrial warehouseswhere multiple inventory tracking devices require simultaneous charging,especially overnight or in between shifts.

Another issue affecting efficacy of present-day multi-device charging atlonger distances is that charging efficacy generally requires properalignment of each power receiving device with the power transmitter.Transmitter housing designs that mechanically align a receiver and atransmitter or transmitter circuitry in a charging system, whetherprovided on one singular printed circuit board or multiple printedcircuit boards, or even when WPT coils may be driven by multiplecontrollers or one controller, do not resolve the above issuesdiscussed.

Yet another issue for present-day longer-distance charging relates tothe limitations and challenges that exist in detection of whetherobjects are even acceptable for charging or whether they are really“foreign” objects that may negatively impact the quality of chargingintended for acceptable devices. Foreign object detection can bechallenging because many times it is difficult to develop schemes toappropriately differentiate between a foreign object and a valid object.Generally, a foreign object is detected by a power loss that itgenerates in overall power transfer. In cases of extended z (orvertical) height and large-volume charging, the acceptable losses in asystem are substantially higher, hence, increasing the difficulty todetermine whether a foreign object is present or not.

In cases where operating distance has been increased, significantamounts of current must also be passed through a transmitter system,coil, and associated components in order to transfer adequate power to areceiver. This increased current creates heat and often causes thetransmitter system to rise in temperature over time. In many cases, thisrise in temperature eventually trips an overheat fault and shuts downthe entire WPT system, disrupting charging service for the user.Traditional thermal mitigation techniques have been applied, includingheat dissipating components such as heatsinks, ridges, fans, etc.;however, product or system requirements can frequently make thesedifficult or impossible to use.

Challenges also exist in the area of communication of data in wirelesspower transfer systems. Many modern power transfer systems are dependenton data communication between a power transmitter and a power receiver,which allows appropriate adjustments to be made that maintain chargingeffectiveness. (Data transfer and power transfer may be done byutilizing a single antenna, or different antennas.) However, oftentimesthere may be other antennas or devices in close proximity which usesimilar communication methodologies, and which can make is difficult todifferentiate and appropriately filter messages that are required foreffective and/or efficient wireless power transfer. In addition to theabove, challenges also exist in handling larger currents required for asystem to provide power at a specified distance and frequency ofoperation. Therefore, component selection is critical to ensure areliable and safe operating system.

Electrical systems have other limitations in certain use cases that mustbe factored in when designing a WPT system. System components such asferrite, which enhance performance of wireless power transfer, can bevulnerable to cracks or breakage if subjected to sudden impact or highstress. Heat buildup is yet another issue; for example, excessive and/orprolonged exposure at elevated temperatures can cause component damage,or can force a system slowdown or shutdown, limiting reliability andutility of the electrical system. Additionally, thermal issues usuallylimit wattage which can be transferred in a system such as a wirelesspower system. This is the case because, given constant voltage, higherwattage transfer levels will require more electric current, and highercurrent levels cause exponentially more heat to be generated due toelectrical resistance.

In general, heat-dissipation features in electronics use aheat-conducting material (such as metal) to remove heat from anapparatus. If this heat-conducting material possesses a large surfacearea which is exposed to air or another surrounding environment, heat istransferred to a surrounding environment efficiently and carried awayfrom the apparatus. Larger surface areas result in more effective heatdissipation, and can be obtained by using larger amounts ofheat-conducting material, and can also be obtained with adaptations suchas fans, fins, pins, bars, and/or other protrusions. Specializedfeatures used to dissipate excess heat in this way are often referred toas “heat sinks.” However, existing systems with heat-dissipationfeatures are often limited because their heat sinks are made of metal,which means magnetic fields can couple to them and increase heatgeneration by, for example, inducing eddy currents. Moreover, existingheat dissipation features are frequently costly to make, and mightrequire exotic materials and/or significant space. Finally, and moreimportantly, heat sinks that are made out of metal will not alwaysprovide adequate electromagnetic interference (EMI) protection, sincethey are not grounded to a main ground plane.

In addition to the above, it is important to note that heat dissipationis critical for multidevice charging solutions, where two or moretransmitters and two or more receivers are built into a system. Withheat-generating components located near each other, their combinedeffect may raise temperature to unacceptable levels quicker than in asingle charged system. More powerful power supplies are used to deliverpower to multiple device systems, and such systems require longer cablesto deliver power from the power supply to every single power transferarea. This results in higher losses that generate more heat. For suchhardware configurations, it becomes critical to redirect heat from whereit is generated to where it can be dissipated into a surroundingenvironment. If cooling with natural convection and conduction is notenough to keep such systems at safe temperature levels, active cooling(with fans or other similar subsystems) has to be used. This furtherincreases complexity and ownership cost of such systems.

In general, present-day wireless power systems operate over shortdistances. For example, typical Qi™ systems use a 3 mm-5 mm coil-to-coildistance range. As such, there is a need for a power-transmitting systemwhich limits electromagnetic interference and heat creation, while alsotransmitting an acceptable amount of power at extended distances.Additionally, there is a need to provide a system that can operate in alow frequency range of 25 kHz-300 kHz.

Likewise, with multiple device charging stations packing multiplewireless charging transmitter systems closer together, inter-systeminterference levels increase. These effects are amplified when thesystems operate on the same technology, i.e., 2 Qi™ transmitters.Therefore, there is a need to address unintended inter-systeminteraction once a coil's center is within approximately 3 times thediameter of a nearby coil. This is true for coils used for power and/ordata transfer.

Additionally, in present-day WPT systems, a power transmitting unit(PTU) can only support communication with a single power receiving unit(PRU), for systems that transfer data between PRU and PTU by modulatinginformation on top of a standing carrier wave. In other words, for everyPRU, the system needs a complete PTU. This increases a final price ofthe charging system as a function of how many PRUs must be supported, aswell as the cost of a PTU [System Cost is proportional to(#PRUs)*(#PTUs)]. Also, for the systems described above, bandwidth (BW)of a data channel is limited by carrier frequency and modulationfrequency, f_(m), where BW=2*f_(m). Additionally, magnitude of amplitudemodulation (AM), directly impacts instantaneous impedances seen by atransmitter power amplifier (PA). (With larger impedance changes, morestable and tolerant power amplifiers are required.) Hence, there is alsoa need for a more rugged, less costly solution.

SUMMARY OF THE INVENTION

This system comprises features which allow the transfer of more powerwirelessly at longer ranges, extended distances and larger volumes thanpresent-day systems operating in the same or similar frequency orfrequency range. The system possesses optional heat dissipationfeatures. These features allow effective operation at the longer ranges,extended distances and larger volumes without excessive temperature riseand/or in elevated-temperature environments. The system may incorporaterugged design features that with stand shock, vibration, drops andimpacts. The system may also include electromagnetic interference (EMI)mitigation features, custom shaped components fabricated from particularmaterials that enhance system performance, or system and/or moduleelectronics that support or direct system conditions and/or performance.Antenna and/or battery integration options are also included.

According to various embodiments of the present disclosure, provided arecomponents, assemblies, modules, and methods for wireless powertransmission (WPT) systems that transfer more power wirelessly at longerranges, extended distances and larger volumes than other systemsoperating in the same or similar frequency ranges and coil sizes. Thevarious embodiments disclosed herein generally apply topower-transmitting (Tx) and/or power-receiving (Rx) systems,apparatuses, transmitters, receivers and related constituents andcomponents. Also, according to various embodiments of the presentdisclosure, disclosed are features, structures, and constructions forlimiting electromagnetic interference (EMI) levels, managing excessheat, ruggedizing to withstand shock, vibration, impacts and drops,detecting foreign objects, communicating data effectively, andmaximizing efficiency of, between and across multiple wireless powertransmitters, each individually or all simultaneously. Also, accordingto various embodiments of the present disclosure, disclosed arefeatures, structures, and constructions for limiting electromagneticinterference (EMI) levels, managing excess heat, ruggedizing towithstand shock, vibration, impacts and drops, detecting foreignobjects, communicating data effectively, and maximizing efficiency of,between and across multiple wireless power transmitters, eachindividually or all simultaneously.

Further, the various embodiments of the present disclosure are appliedto either a Qi system, Qi-like system, or similar low frequency systemsso that when the embodiments within are incorporated into such systems,the embodiments within enable the transfer of more power by thesesystems at a longer range, an extended distance and a larger volume.This is accomplished by redirecting, reshaping and/or focusing amagnetic field generated by a wireless Tx system so that at longerranges, extended distances and larger volumes the magnetic fieldchanges. The present application provides various embodiments of coildesign, firmware settings (which affect the control loop), andmitigation of heat features (which may have significant temperature risedue to the electrical current required in order to reach these longerranges, extended distances and larger volumes), which may each beincorporated within such systems separately or in combinations thereof.

In some embodiments disclosed, a component, an assembly, a module, astructure, a construct or a configuration comprises one or moreprotective materials, wherein the one or more protective materialsavoids or suppresses one of a movement, a stress, a pressure, an impact,a drop, a shock, a vibration, or combinations thereof. In someembodiments, the protective material comprises one of a foam, anadhesive, a resin, an elastomer, a polymer, a plastic, a composite, ametal, an alloy, an interface material, a pad, a plate, a block, asheet, a film, a foil, a fabric, a weave, a braid, a mesh, a screen, anencapsulation, or a custom form, and combinations thereof. In someembodiments, the protective material comprises one or morepressure-sensitive adhesives. In some embodiments, the protectivematerial comprises one or more encapsulations. In some embodiments, theone or more encapsulations comprises one or components. In someembodiments, the one or more encapsulation components comprise at leastone of the protective materials listed above. In some embodiments, theone or more encapsulations surround one or more individual components ofa power system. In some embodiments, the one or more encapsulationcomponents comprise a bracket, a holder, a brace, and/or a mechanicalsupport construct.

Embodiments disclosed herein comprise a component, an assembly, amodule, a structure, a construct or a configuration comprising one of amagnetic material, a ferrimagnetic material, or combinations thereof,wherein the component, the assembly, the structure, the construct or theconfiguration reshapes a magnetic field generated by a wireless powertransmitter so that the magnetic field is more concentrated at a distantposition or at a spatial volume location at or within which a powerreceiver resides. Such magnetic field concentration increases couplingbetween the transmitter and the receiver, resulting in more efficientpower transfer. Some embodiments further comprise a component, anassembly, a module, a structure, a construct or a configuration havingone of a magnetic material, a ferrimagnetic material, or combinationsthereof, wherein the component, the assembly, the structure, theconstruct or the configuration comprises a magnetic material, themagnetic material comprising a surface having a surface area, whereinthe surface of the magnetic material comprises one or more horizontalplanes, each horizontal plane optionally comprising one or moreprojections extending vertically from at least one of the one or morehorizontal planes.

Embodiments disclosed comprise features which dissipate heat moreeffectively than present-day power-transmitting (Tx) systems, limitingheat buildup and creating new options for using the subject technologyin a wide range of applications. Some embodiments comprise one or morepower transmitting coils positioned over a chassis, the chassiscomprising a high thermal conductivity material or a metal, wherein thechassis is capable of dissipating heat and/or configured to dissipateheat. The chassis may further comprise a heat spreader at leastpartially adhered to one or more surfaces of the chassis. The chassismay further be selected from the group consisting of a bracket, aholder, a brace, a bezel, a framework, a frame, a skeleton, a shell, acasing, a housing, a structure, a substructure, a bodywork, a body, acomponent, an assembly, a module, a structure, a construct, aconfiguration, and a mechanical support.

Embodiments can be especially useful in demanding applications, forexample, when operating in elevated temperature environments, withinlimited spaces, at high power, at high electrical currents, at highvoltages, using costly active cooling devices, and the like. In suchcases, components must remain below a certain temperature to operateeffectively. For example, one reason that typical wireless power systemsare not used for extended-range or extended-power applications isbecause doing so would increase voltage and current, causing excessiveheat buildup that could endanger operations and possibly cause a systemshutdown. Specifically regarding using active cooling devices,embodiments of the present application dissipate heat without activecooling, which has the added benefit of lowering cost. However, heatdissipating embodiments of the present application may be configured tocomprise active cooling. The active cooling may further comprise amechanical cooling structure and/or a liquid cooling structure. Someembodiments effectively dissipate heat, allowing continued operation ofsystems and processes even when operating requirements and or conditionscause significant heat to be generated.

Embodiments disclosed herein comprise a magnetic material backing with amagnetic material core, wherein the magnetic material backing with themagnetic material core increases coupling by focusing magnetic fields ina more uniform direction. The magnetic material backing with themagnetic material core comprises one of a flat configuration, a “tophat”, a T-core, a T-shape, an E-core or an E-shape magnetic materialstructure. The magnetic material structure further comprises a basehaving a thickness and one or more protrusions or other separatestructures residing either above that base or below the base, with orwithout one or more projections. The resulting increase in couplingbetween a transmitter and a receiver translates into more effectivepower transfer and less power dissipation, even if distance between atransmitter and receiver is increased. In some embodiments, the magneticmaterial backing is of a larger dimension than is typically found instandard present-day WPT systems, which provides a transmitter thatoffers higher efficiency than the WPT systems of today. This higherefficiency is in addition to the extended-distance and volumeperformance, which present-day WPT systems typically cannot do. Hence,this offers particular advantage in use cases where having a compacttransmitter is less important than having higher wireless power transferefficiency at longer ranges, extended distances and larger volumes.

Some embodiments disclosed herein include a single coil, a multi-layercoil, a multi-tiered coil, or combinations thereof. In some embodimentsthe single coil, the multi-layer coil, the multi-tiered coil, or thecombinations thereof reside on one or more planes. Coils residing on oneor more planes further increase coupling and spatial freedom between thewireless transmitter and the wireless receiver. One or more single coil,multi-layer coil, multi-tiered coil or combinations thereof arepositionable on, at, near or adjacent a magnetic material. One or moresingle coil, multi-layer coil, multi-tiered coil or combinations thereofmay comprise a first coil portion positioned on, at, near or adjacent afirst magnetic material, and a second coil portion positioned on, at,near or adjacent a second magnetic material. One or more single coil,multi-layer coil, multi-tiered coil or combinations thereof may comprisea coil portion positioned on, at, near or adjacent n-number of magneticmaterials. The multi-layer and multi-tiered coils may be connected inseries, may reside in one or more horizontal planes, or both. Someembodiments comprise either a Tx coil, an Rx coil, or both, wherein theTx coil, the Rx coil, or both comprise one of a single coil, amulti-layer coil, a multi-tiered coil, or combinations thereof, whereinthe Tx coil, the Rx coil, or both are positioned on, at, near oradjacent one of a magnetic material, a magnetic material comprisingmultiple pieces, or one or more magnetic materials. The magneticmaterial comprising multiple pieces, the one or more magnetic materials,or both may further comprise the same material or two or more differentmagnetic materials. Two or more Tx coils, or Rx coils and theirrespective driving circuitry may each be configured to be controlled bya common controller, or alternately may each be controlled by its ownunique controller. Some embodiments comprise either a Tx coil, an Rxcoil, or both, wherein the Tx coil, the Rx coil, or both comprise one ofa single coil, a multi-layer coil, a multi-tiered coil, or combinationsthereof, wherein the single coil, the multi-layer coil, the multi-tieredcoil, or combinations comprise one or more extended connection ends,wherein a portion of at least one of the extended connection endscomprises an insulating material. The insulating material may further beconfigured to surround only the at least one extended connection end. Inthis case, the insulating material does not surround any portion of thewire of the coil structure. In some embodiments, a power systemcomprises one of a single coil, a multi-layer coil, a multi-tiered coil,or combinations thereof. A multi-layer or a multi-tiered coil mayfurther comprise a first coil part positioned within a first plane and asecond coil part positioned within a second plane. In some embodiments,a multi-layer or multi-tiered coil is an antenna configured to transferpower, energy and/or data wirelessly.

Embodiments disclosed herein provide power transfer at distances ofabout 5 mm to about 25 mm, when the wattage range is greater than 1 nWup to 30 W. These power transfer distances are further provided whileoperating at frequencies ranging from 25 kHz to 300 kHz, the range ofwhich includes the Qi™ frequencies; for example, a most common PowerTransmitter design A11 from Qi™ (WPC) operates at frequencies between110 kHz-205 kHz. As a point of reference, these type of present-dayconfigured Qi™-compatible systems typically operate at distances of only3 mm to 5 mm to effectively transfer power wirelessly; hence, theembodiments disclosed herein are capable of transmitting power atdistances from 5 times to a little over 8 times the 3 mm to 5 mmdistances of the present-day Qi™-compatible systems.

Embodiments disclosed herein provide reduced EMI. Some embodimentsprovide reduced EMI by operating at a fixed frequency, and someembodiments provide reduced EMI while operating at a variable frequency.

The embodiments and descriptions disclosed in this specification arecontemplated as being usable separately, and/or in combination with oneanother. Furthermore, in this disclosure, the terms “bracket” and“brace” are used interchangeably. The terms refer to a component whichis configured to hold other components in place, and which might also beconfigured to provide features such as thermal conductivity, electricalconductivity, thermal insulation, electrical insulation, or combinationsthereof.

Some embodiments comprise one or more circuit boards, circuitry, and/orfirmware. In some of these embodiments, the circuit board comprises aprinted circuit board (PCB).

Circuitry is defined herein as a detailed plan or arrangement of acircuit or a system of circuits that performs a particular function in adevice or an apparatus. The circuit provides a line or path along whichpower, energy or data travels, such as in driving, sending, accepting,broadcasting, communicating, dissipating, conducting or carrying asignal, power, energy and/or data. In some embodiments, the circuitry isa conditioning circuitry. Some embodiments may comprise one or moredriving circuits. Two or more driving circuits may be replicas of oneanother. Two or more driving circuits may reside on either a singlecircuit board or two or more circuit boards. In some embodiments, theconditioning circuitry comprises a resistor network. In someembodiments, the conditioning circuitry specifies a threshold foractivation. The activation threshold is a protection and/or an operationthreshold comprising one of an over voltage protection (OVP), an undervoltage protection (UVP), an over current protection (OCP), an overpower protection (OPP), an over load protection (OLP), an overtemperature protection (OTP), a no-load operation (NLO) a power goodsignal, and combinations thereof. In some embodiments, the conditioningcircuitry comprises a positive temperature coefficient (PTC) fuse. Insome embodiments, one or more of the PTC fuses is resettable. In someembodiments, the conditioning circuitry comprises one or morefield-effect transistors (FETs). In some embodiments, one or more FETscomprise a P-channel or P-type metal oxide semiconductor FET(PMOSFET/PFET) and/or an N-channel or N-type metal oxide semiconductorFET (NMOSFET/NFET). Some embodiments comprise one of an FET, an NFET, aPFET, a PTC fuse, or combinations thereof. Some embodiments furthercomprise one of an FET, an NFET, a PFET, a PTC fuse, or combinationsthereof within one or more integrated circuits, one or more circuitboards, or combinations thereof. Some embodiments comprise conditioningcircuitry comprising components having current ratings of 4 A-10 A. Someembodiments comprise one or more Q factor sensing circuits having aresistor comprising a power rating of 0.5 W. Some embodiments compriseone or more coil tuning capacitors having a voltage rating of 100 V-400V. Such a voltage rating mitigates damage of, for example, coil tuningcapacitors while operating at power transfers up to 30 W. Someembodiments comprise one or more inductors having power conversioncurrent saturation ratings of 7 A-20 A. Such ratings prevent damage towireless power system circuitry while operating at power transfers up to30 W and/or when subjected to large in-rush currents. Some embodimentscomprise one or more resistors having an electrical resistance of about10 k ohms to about 150 k ohms. The one or more resistors may be used todemodulate communication.

Firmware is a specific class of software with embedded softwareinstructions that provides a control function for a specific hardware.For example, firmware can provide a standardized operating environment,allow more hardware-independence, or, even act as a complete operatingsystem, performing all control, monitoring and data manipulationfunctions. In the present application, firmware provides instruction forsending, accepting, broadcasting, communicating, dissipating, conductingor carrying a signal, power, energy and/or data with other devices orapparatuses so that a function is performed. Some embodiments comprisefirmware comprising an instruction, the instruction comprising one of atuning instruction, a detection instruction, an authenticationinstruction, a settings instruction, a verification instruction, aninterrogation instruction or combinations thereof. The firmwareinstruction may further comprise one of tuning, adjusting, foreignobject detection (FOD), authentication, authentication mediation,verification, interrogation, and/or power requirement detection. Any ofthese may be executed dynamically, and may further be based on inputsreceived in real time. In some embodiments, the instruction providesfunctional instruction to a component, an assembly, a module, astructure, a construct or a configuration. For example, a firmware mayadjust coil gain, mediate authentication between a transmitter and areceiver prior to starting wireless power transfer, and/or differentiatebetween a foreign object and an acceptable object by interrogating theelectronics or firmware of each before initiating the function. In someembodiments, a firmware works in concert with electronics to interrogateand/or verify an object is foreign or acceptable before and/or afterpower transfer. In some embodiments, firmware dynamically adjusts FODlimits by learning from previous receiver data.

Some embodiments comprise controller firmware comprising an instructionto limit an amount of current passing through a transmitter coil. Thecurrent limit may further be statically set by a system designer. Thecurrent being passed through the transmitter coil can be varied bymethods that include but are not limited to: frequency modulation,amplitude modulation, duty cycle modulation, phase modulation, orcombinations thereof. In some embodiments, controller firmware comprisesan instruction to limit an amount of current passing through atransmitter coil based on a static threshold that is programmed into acontroller. In some embodiments, controller firmware comprises aninstruction to limit an amount of current passing through a transmittercoil, wherein the limit can be dynamically calculated based on a dataset of parameters that is either pre-programmed or measured directly ona transmitter device. These parameters may include, but are not limitedto: ambient temperature, magnetic field strength, system input current(especially if multiple transmitters are being used), or combinationsthereof. Some embodiments comprise a controller firmware comprising aninstruction to synchronize two or more wireless power systems. Thecontroller firmware synchronization instruction may further comprise oneof an instruction to reduce idle power, an instruction to control atotal maximum delivered power, an instruction to control a total maximumdelivered power to each of one or more receivers, an instruction tooptimize power delivery compliant with a system thermal thresholdlimits, or combinations thereof. Some embodiments comprise a controllerfirmware comprising an instruction to optimize power delivery betweenmultiple receivers. The controller firmware optimization instruction mayfurther comprise an instruction that is based on one of a maximumallowable thermal rise, a maximum allowable voltage, a maximum allowablecurrent, or combination thereof, wherein the basis of the thermalthreshold limits resides with in either a receiver or a transmitter.Some embodiments comprise a controller firmware comprising aninstruction to vary one of one or more duty cycles, phase, one or morevoltages, one or more frequencies, or combinations thereof of a drivingcircuitry. The varying instruction may further comprise one of aninstruction to maximize efficiency across one or more wireless powertransmitters simultaneously, an instruction to maintain a singleoperating frequency, an instruction to tune to a maximum efficiency, orcombinations thereof. Embodiments comprise a controller firmwarecomprising an instruction. Embodiments comprise a controller, whereinthe controller operates at a variable frequency comprising range of 25kHz-300 kHz.

Some embodiments comprise a bracket or holder, the bracket or holderfurther comprising a container, a receptacle, a case, a casing, a cover,a covering, a housing, a sheath, a stand, a rest, a support, a base, arack, or combinations thereof. The bracket or the holder in someembodiments provide one of heat conductivity, heat dissipation, thermalconductivity, thermal insulation, electrical conductivity, electricalinsulation, mechanical stability, mechanical support, structuralruggedness where said mechanical bracket is also configured to providemechanical stability. The bracket may be mechanical, a board or anassembly of various individual components assembled to fasten, holdsupport and/or shield a power system, a power-generating system, apower-transmitting system, a power-receiving system, or assemblies,modules and combinations thereof.

Some embodiments comprise one or more components configured to providethermal conductivity, thermal insulation, electrical conductivity,electrical insulation, electrical grounding, structural integrity, orcombinations thereof.

Some embodiments comprise one or more components with magnetic and/orferrimagnetic properties which are configured to enhance inductiveelectrical coupling. The components with magnetic and/or ferrimagneticproperties further comprise a portion which is positioned next to,behind, under or below an antenna coil. Some embodiments, alternatelycomprise one or more components with magnetic/ferrimagnetic properties,wherein at least one component is either partially or completelysurrounded by an antenna coil. Some embodiments comprise one or morecomponents with magnetic/ferrimagnetic properties. The one or morecomponents with magnetic/ferrimagnetic properties may further comprise afirst portion positioned under an antenna coil and a second portionsurrounded by an antenna coil, or vice versa. Each antenna coil maycomprise the same coil material, coil wire type, and/or coilconstruction, a different coil material, coil wire type, and/or coilconstruction, or combinations thereof. The first and second portions ofthe one or more components with magnetic/ferrimagnetic properties mayfurther be positioned one atop another. In some embodiments, said secondportion is positioned atop said first portion, or vice versa. In someembodiments, one of an apparatus, a device, an assembly, a module, or apower system comprises one or more components withmagnetic/ferrimagnetic properties, or comprises a component with one ofa first magnetic/ferrimagnetic material and a second magnetic material,wherein the first and second magnetic/ferrimagnetic materials each maybe the same or each may be different. In some embodiments, one of anapparatus, a device, an assembly, a module, or a power system comprisesa third magnetic/ferrimagnetic component which is positioned partiallywithin or fully within a coil. Said coil may further comprise a singlecoil, a multi-layer coil, or a multi-tiered coil. In some embodiments,the third magnetic/ferrimagnetic component further comprises a coil,wherein the coil is a wound coil, and wherein the wound coil is eitherpartially or fully wound.

Some embodiments comprise one or more thermal insulator materials. Insome embodiments, one or more thermal insulator materials comprise foam.

In some embodiments, the apparatus comprises one or more empty gaps,positioned between heat-generating components and one or more outersurfaces. The one or more empty gaps further comprise air.

In some embodiments, the apparatus comprises an electronic componentcomprising one or more pass-through holes, wherein said one or morepass-through holes are connectable to one or more of a coil, a wire, awire connection end or a conductor. The one or more pass-through holesare further connectable by a conductive plating surrounding at least oneof the one or more pass-through holes. The one or more pass-throughholes are alternately connectable by one of a via, a solder, a tab, awire, a pin, a screw, a rivet, or combinations thereof.

Some embodiments comprise one or more components with at least onenotch. The at least one notch further comprises one or moreindentations. Such notches and/or indentations manage the development ofeddy currents due to current passing through a coil.

Some embodiments comprise a coil or a conductor, wherein the coil or theconductor comprises one or more connection ends. In some embodiments,the one or more connection ends are bent at an angle ranging from about70° up to about 110°.

Some embodiments disclosed herein comprise an inverter. The inverter isconfigured to operate in an apparatus, a device, an assembly, a module,or a power system. In some embodiments, the inverter is a full-bridgeinverter configured to operate at a fixed frequency. In someembodiments, the inverter is a half-bridge inverter that is configuredto operate at a fixed frequency.

Some embodiments disclosed herein comprise a power receiver or apower-receiving system, wherein the power receiver or thepower-receiving system comprises a spacer. Said spacer is furtherpositioned between a receiving coil and a battery. In some embodiments,said spacer is positioned between a magnetic/ferrimagnetic component anda battery. In some embodiments, the power receiver or thepower-receiving system is a module. Said module further comprises one ormore antennas, one or more battery packs, one or more batteries, orcombinations thereof.

Some embodiments comprise a wireless power transfer system, wherein oneof a power, an energy or data are transmitted to two or more receivers,wherein the two or more receivers comprise one of a different electricalload, a different profile, or both. The power transfer system may be amultiple device power transfer system. Some embodiments comprise a Txsystem, wherein data transfer to one or more receiving devices comprisesa data antenna different from a power antenna. Some embodiments comprisea Tx system, wherein one or more transmitters dynamically assign afrequency or a frequency range. Some embodiments comprise a Tx system,the assigned frequency or frequency range of the one or moretransmitters minimize noise and/or mitigate and/or manage an effect of asource of the noise.

Some embodiments are multiple device power system embodiments, whereinthe multiple device power system comprises two or more wireless powersystems contained within a single mechanical housing, the singlemechanical housing comprising one or more structural components. Someembodiments comprise a housing, wherein the housing comprises amechanical alignment feature comprising either a flat or a non-flatsurface. Non-flat alignment surfaces are further configured to align acenter or centers of one or more Tx coils to a center or centers of oneor more Rx coils. The alignment center or centers of the of one or moreTx coils to the one or more Rx coils comprises a maximum offset of 10mm. Some embodiments comprise a multi-bay power system, the multi-baypower system comprising one or more transmitters, wherein eachtransmitter is individually capable of power transmission to and one ormore receivers. Some embodiments further comprise a transmitter housing,the transmitter housing may further be configured to ensure alignmentbetween each of the transmitter and the receiver coils. Some embodimentscomprise a wireless power controller configured to measure currentpassing through a transmitter coil. The wireless power controllerfurther comprises one of a circuit for measuring voltage over a smallresistor, a tuning capacitor in series with the transmitter coil, amagnetic current sensing element, or combinations thereof. Someembodiments are configured to vary power by one of a frequencymodulation, an amplitude modulation, a duty cycle modulation, phasemodulation, or combinations thereof. Some embodiments may further beconfigured to vary power to individual Rx apparatus or device by one ofa frequency modulation, an amplitude modulation, a duty cyclemodulation, phase modulation, or combinations thereof. Some embodimentscomprise firmware comprising an instruction for varying power by one ofa frequency modulation, an amplitude modulation, a duty cyclemodulation, phase modulation, or combinations thereof. Some embodimentscomprise firmware further comprising an instruction for varying power byone of a frequency modulation, an amplitude modulation, a duty cyclemodulation, phase modulation, or combinations thereof. Some embodimentsmay be configured to manage heat generated by a constituent or acomponent of a Tx and/or an Rx apparatus or device in addition tovarying power by one of a frequency modulation, an amplitude modulation,a duty cycle modulation, phase modulation, or combinations thereof.

In some embodiments, a transmitter communicates with a receiver and awireless power connection is negotiated between them. In someembodiments, a current limit may be programmed as a static value; thisstatic value may be a maximum current level that is passed through atransmitter coil without causing an over-temperature fault. In someembodiments, a current limit can be dynamically calculated using datafrom a table and/or data from sensor measurements. In some embodiments,a transmitter controller is configured to vary current going through atransmitter coil in order to reduce transmitter power losses. In someembodiments, a transmitter controller is configured to negotiate a powerconnection with a receiver during an initial handshake and can beconfigured to deny any further power increases if measured transmittercoil current exceeds a set current limit and/or a certain temperaturelimit. In some embodiments, this negotiation is dynamic. In someembodiments, a transmitter controller is configured to negotiate a powerconnection with a receiver during an initial handshake and change apower transfer connection to a lower power scheme to reduce transmittercoil current based on a set current limit and/or a temperature limit. Insome embodiments, this negotiation is dynamic. In some embodiments, atransmitter or receiver is configured to periodically renegotiate awireless power connection, and a transmitter controller can deny anyfurther power increases to a receiver based on a set current limit. Insome embodiments, a transmitter or receiver is configured toperiodically renegotiate a wireless power connection, and a transmittercontroller can change a power transfer connection to a lower powerscheme to reduce transmitter coil current based on a set current limit.In some embodiments, a controller is configured to encode/decode datausing a time slotting technique. In some embodiments, a controller isconfigured to encode/decode data using frequency modulation, FM. In someembodiments, a controller is configured to encode/decode data usingcoding modulation (CM), such as but not limited to Hadamard/Walsh code.In some embodiments, a controller is configured to encode/decode datausing impedance modulation (IM) by dynamically adjusting impedance ofcoupled coils. In some embodiments, a controller is configured toimplement analog and/or digital filtering. In some embodiments, a Txcontroller is configured to select operating frequency based on sensingspectral intensity of available operating frequencies. In someembodiments, a power-receiving (Rx) controller is configured to ditheran encoding frequency to reduce spectral peak energy associated with Rxdata generation. In some embodiments, a Tx controller is configured todither an operating frequency to reduce spectral peak energy associatedwith carrier wave generation. In some embodiments, a Tx controller isconfigured to dither an operating amplitude to reduce spectral peakenergy associated with carrier wave generation.

In some example applications for wireless power transfer, it is desiredto power and/or charge multiple electronic devices simultaneously.Currently, systems and/or products exist, employing multiple transmittercoils and associated driver circuits, wherein each system couples withan individual receiving device. However, such systems that currentlyexist may be prone to interference between one receiver and bothtransmitters, leading to potential inefficiencies and/or complicationsin communications capability or causing degradation to communicationscapabilities.

To that end, wireless power transmitter sets capable of independentlypowering multiple wireless receivers are desired, wherein removal of onereceiver system does not cause crosstalk between the remaining receiverand the ostensibly idle transmitter system.

In accordance with one aspect of the disclosure, a dual wireless powertransfer system is disclosed having an input power supply providingpower at a first voltage V1 and a first wireless power transmissionsystem receiving power at a first power input from the input powersupply, the first wireless power transmission system including a firsttransmitter antenna and a first transfer circuit for driving the firsttransmitter antenna for wireless power transmission to a first wirelessreceiver system and wireless receipt of data from the first receiversystem, wherein data wirelessly received at the first transmitterantenna from the first receiver system at least partially feeds backonto the first power input. A second wireless power transmission systemincludes a second transmitter antenna and a second transfer circuit fordriving the second transmitter antenna for wireless power transmissionto a second wireless receiver system. A low voltage drop out receivespower from the input power supply at V₁ and provides power at apreselected lower voltage V₂ to the second wireless power transmissionsystem, such that V₂ is independent of data received at the firsttransmitter antenna.

In a refinement, the first and second transfer circuits each comprise anH-Bridge, and further, the data wirelessly received at the firsttransmitter antenna that at least partially feeds back onto the firstpower input may be fed back by a power input of the H-Bridge.

The voltage V₁ varies over a range having a lowest value, and in anaspect, the preselected voltage V₂ may be set to remain below V₁.

In a refinement, one or both of the first and second receiver systemsincludes a powered load, and in further refinement, the load is anelectrical energy storage device. The first and second wireless powertransmission systems further include respective transmission controllersin a refinement, configured to provide respective antenna signals to therespective antenna drivers.

In a refinement, the communications signals are coded via amplitudeshift keying (ASK), and in yet a further refinement, the first andsecond transmission antennas are configured to operate based on anoperating frequency of about 88-360 kHz.

In another aspect of the disclosure, a dual wireless power transfersystem is provided having an input power supply providing power at afirst voltage V₁ as well as a first wireless receiver system and asecond wireless receiver system, each wireless receiver system beingconfigured to wirelessly receive power from a respective wireless powertransmission system via a wireless power protocol and to wirelesslytransmit data to the respective wireless power transmission system viathe wireless power protocol. In this aspect, a first wireless powertransmission system is provided for receiving power at a first powerinput from the input power supply, the first wireless power transmissionsystem including a first transmitter antenna and a first transfercircuit for driving the first transmitter antenna for wireless powertransmission to the first wireless receiver system and wireless receiptof data from the first receiver system, wherein data wirelessly receivedat the first transmitter antenna from the first receiver system at leastpartially feeds back onto the first power input.

Further, a second wireless power transmission system includes a secondtransmitter antenna and a second transfer circuit for driving the secondtransmitter antenna for wireless power transmission to the secondwireless receiver system, and a low voltage drop out receiving powerfrom the input power supply at V₁ and providing power at a preselectedlower voltage V₂ to the second wireless power transmission system at asecond power input, such that V₂ is independent of data received at thefirst transmitter antenna that is at least partially fed back onto thefirst power input.

In a refinement, the first and second transfer circuits each comprise anH-Bridge and the data wirelessly received at the first transmitterantenna is partially fed back by a power input of the H-Bridgeassociated with the first transmitter antenna. In a further refinement,V₁ varies over a range having a lowest value, and wherein thepreselected voltage V₂ is set to remain below the lowest value of therange of V₁.

In another refinement, one or both of the first and second receiversystems includes a powered load, and in a further refinement, the loadis an electrical energy storage device.

In a refinement of this aspect, the first and second wireless powertransmission systems include respective transmission controllersconfigured to provide respective antenna signals to the respectiveantenna drivers.

In another aspect, a dual wireless power transmission system includes apower input configured to receive electrical power at a first voltageV₁, a first wireless power transmission system receiving power from thepower input, the first wireless power transmission system including afirst transmitter antenna and a first transfer circuit for driving thefirst transmitter antenna for wireless power transmission to the firstwireless receiver system and wireless receipt of data from a firstreceiver system, wherein data wirelessly received at the firsttransmitter antenna from the first receiver system at least partiallyfeeds back onto the power input, and a second wireless powertransmission system including a second transmitter antenna and a secondtransfer circuit for driving the second transmitter antenna for wirelesspower transmission to a second wireless receiver system.

In this aspect, a voltage reduction element is provided, receiving powerfrom the power input and providing power at a voltage lower than that ofthe power input to the second wireless power transmission system,wherein the power output by the voltage reduction element is independentof voltage variations on the power input.

Other principal features and advantages of the invention will becomeapparent to those skilled in the art upon review of the followingdrawings, the detailed description, and the appended claims

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exploded perspective view of a portion of apower-transmitting (Tx) system embodiment. FIG. 1 is absent apower-transmitting coil assembly.

FIG. 2 illustrates an exploded perspective view of a Tx systemembodiment showing the constituents of FIG. 1 and a power-transmittingcoil assembly.

FIG. 3A shows a perspective view of the Tx system embodiment of FIG. 2assembled.

FIG. 3B illustrates a magnified view of a portion of the assembled Txsystem embodiment.

FIG. 4 is a top view of the assembled Tx system embodiment of FIG. 3A.

FIG. 5 is a bottom view of the assembled Tx system embodiment of FIG.3A.

FIG. 6A is a first side view of the assembled Tx system embodiment ofFIG. 3A.

FIG. 6B is a second side view of the assembled Tx system embodiment ofFIG. 3A.

FIG. 6C is an end view of the assembled Tx system embodiment of FIG. 3 .This end view is opposite the end showing coil end connections.

FIG. 7 is taken from section 7-7 of FIG. 6B, illustrating across-section of the assembled Tx system embodiment.

FIG. 8 is a cross-sectional view of a Tx system embodiment with thermalmanagement features.

FIG. 9A is a perspective view of a T-shape magnetic material embodiment.

FIG. 9B illustrates an exploded perspective view of the magneticmaterial embodiment of FIG. 9A in relation to a bracket.

FIG. 9C illustrates a perspective view of the magnetic material and thebracket after assembly

FIG. 9D is a perspective top view of an E-core magnetic materialembodiment.

FIG. 9E is a perspective view of an alternative E-core magnetic materialembodiment.

FIG. 9F is an exploded perspective view of a Tx coil and the E-coremagnetic material embodiment of FIG. 9E.

FIG. 9G is a perspective view of a Tx coil and the E-core magneticmaterial embodiment of FIG. 9F after assembly. This Tx coil shows anadditional coil layer versus the single coil layer of FIG. 9F. Theadditional coil layer is positioned atop the outer rim of the E-coremagnetic.

FIG. 9H illustrates an actual simulation of the magnetic field generatedby the Tx coil of FIG. 9F and a standard Rx phone coil.

FIG. 10A is an image of an embodiment illustrating a magnetic materialand a power-transmitting coil. The coil shows a right angle bend to theconnection ends.

FIG. 10B is a magnified image of the connection end portion of theembodiment of FIG. 10A attached to a circuit board and bracket assembly.

FIG. 10C is the same image as FIG. 10B except that the image has beenannotated to accentuate the coil connection ends to the circuit boardand bracket assembly.

FIG. 11A is an image of an end view of a power-receiving (Rx) system.

FIG. 11B is an image of a side view of the Rx system of FIG. 11A.

FIG. 12 is an exploded perspective view of an embodiment of an Rx coilof the Rx system of the present application.

FIG. 13 is a schematic of an electrical circuit for use in a Tx system.

FIG. 14 is an image of a prior art standardized MP-A2 Tx coil.

FIG. 15 is an image of a prior art standardized A11/MP-A11 Tx coil.

FIG. 16 is an exploded perspective view of a Tx system embodiment withthermal management features.

FIG. 17 is taken from 17-17 of FIG. 16 , illustrating a cross-section ofthe Tx system embodiment.

FIG. 18 is an exploded perspective view of constituents of a portion ofthe assembled Tx system embodiment of FIG. 17 showing thermal managementconstituents.

FIG. 19 is similar to FIG. 18 , except this exploded perspective viewincludes a Tx coil assembly.

FIG. 20 is a perspective view of the Tx system of FIG. 19 afterassembly.

FIG. 21 is an exploded perspective view of a Tx coil assemblyembodiment.

FIG. 22 shows a perspective view of the assembled Tx coil embodiment.

FIG. 23A is a schematic block diagram for a multi-device wireless powertransmission system embodiment.

FIG. 23B illustrates the embodiment of the Tx coil assembly of FIG. 22in an arrangement for use in the multi-device wireless powertransmission system embodiment of FIG. 23A.

FIG. 24A is a schematic block diagram for another multi-device wirelesspower transmission system embodiment.

FIG. 24B illustrates the embodiment of the Tx coil assembly of FIG. 22in an arrangement for use in the multi-device wireless powertransmission system embodiment of FIG. 23A.

FIG. 25A illustrates an embodiment of the multi-device wireless powertransmission system(s) of FIGS. 23-24 with a three-dimensional housingembodiment.

FIG. 25B illustrates the embodiment of FIG. 25A, wherein wirelessreceiver devices are mechanically and/or electrically connected with thewireless power transmission system via structural features of thehousing embodiment.

FIG. 25C illustrates another embodiment of the multi-device wirelesspower transmission system(s) of FIGS. 23-24 with a modularthree-dimensional housing embodiment.

FIG. 26 illustrates a removable connection of the modular housingembodiment of FIG. 25C.

FIG. 27 is a block diagram of an embodiment of a system for wirelesslytransferring one or more of electrical energy, electrical power signals,electrical power, electromagnetic energy, electronic data, andcombinations thereof, in accordance with the present disclosure.

FIG. 28 is a schematic diagram of a demodulation circuit usable inaccordance with the present disclosure.

FIG. 29 is a schematic diagram of a circuit for alleviating datafeedback between transmitter antennas in accordance with the presentdisclosure.

While the following detailed description will be given with respect tocertain illustrative embodiments, it should be understood that thedrawings are not necessarily to scale and the disclosed embodiments aresometimes illustrated diagrammatically and in partial views. Inaddition, in certain instances, details which are not necessary for anunderstanding of the disclosed subject matter or which render otherdetails too difficult to perceive may have been omitted. It shouldtherefore be understood that this disclosure is not limited to theparticular embodiments disclosed and illustrated herein, but rather to afair reading of the entire disclosure and claims, as well as anyequivalents thereto. Additional, different, or fewer components andmethods may be included in the systems and methods.

DETAILED DESCRIPTION OF THE INVENTION

The following detailed description of the present application refers tothe accompanying figures. The description and drawings do not limit thesubject technology; they are meant only to be illustrative of exampleembodiments. Other embodiments are also contemplated without departingfrom the spirit and scope of what may be claimed.

In the following description, numerous specific details are set forth byway of these examples in order to provide a thorough understanding ofthe relevant teachings. However, it should be apparent to those skilledin the art that the present teachings may be practiced without suchdetails. In other instances, well known methods, procedures, components,and/or circuitry have been described at a relatively high-level, withoutdetail, in order to avoid unnecessarily obscuring aspects of the presentteachings.

While this specification contains many specifics, these should not beconstrued as limitations on the scope of what may be claimed, but ratheras descriptions of particular implementations of the subject matter.Certain features that are described in this specification in the contextof separate embodiments can also be implemented in combination in asingle embodiment. Conversely, various features that are described inthe context of a single embodiment can also be implemented in multipleembodiments separately or in any suitable sub combination. Moreover,although features may be described above as acting in certaincombinations and even initially claimed as such, one or more featuresfrom a claimed combination can in some cases be excised from thecombination, and the claimed combination may be directed to a subcombination or variation of a sub combination.

Referring now to the drawings, embodiments of the subject technology areshown and disclosed.

FIG. 1 illustrates an exploded perspective view of a portion of apower-transmitting (Tx) system 100 embodiment. The constituents showninclude an electrically insulating material 101, a magnetic material 102a, 102 b, a bezel 103, an adhesive 104, a bracket 105, a thermal gasket106, a circuit board 107, a metal spring washer 108 a, 108 b, and ascrew 109 a, 109 b.

FIG. 2 illustrates an exploded perspective view of a Tx systemembodiment having the constituents of FIG. 1 and a power-transmitting(Tx) coil 111 component. The Tx coil 111 comprises an electricallyconductive wire. A wire is a conductor. As defined herein, the word“wire” is a length of electrically conductive material that may eitherbe of a two dimensional conductive line or track with negligiblethickness that may extend along a surface, or alternatively, a wire maybe of a three dimensional conductive line or track having a definedthickness or diameter that is contactable to a surface. A wire maycomprise a trace, a filar, a filament or combinations thereof. A “trace”is an electrically conductive line or track that may extend along asurface of a substrate. The trace may be of a two dimensional line thatmay extend along a surface or alternatively, the trace may be of a threedimensional conductive line that is contactable to a surface. A “filar”is an electrically conductive line or track that extends along a surfaceof a substrate. A filar may be of a two dimensional line that may extendalong a surface or alternatively, the filar may be a three dimensionalconductive line that is contactable to a surface. A “filament” is anelectrically conductive thread or threadlike structure that iscontactable to a surface. These elements may be a single element or amultitude of elements such as a multifilar element or a multifilamentelement. Further, the multitude of wires, traces, filars, and filamentsmay be woven, twisted or coiled together such as a Litz wire, a ribbon,or a cable. The wire as defined herein may comprise a bare metallicsurface or alternatively, may comprise a layer of electricallyinsulating material, such as a dielectric material that contacts andsurrounds the metallic surface of the wire.

The Tx coil 111 of FIG. 2 is a round coil, but other coilconfigurations, such as a circular solenoidal configuration, a squaresolenoidal configuration, a circular spiral configuration, a squarespiral configuration, a rectangular configuration, a triangularconfiguration, a circular spiral-solenoidal configuration, a squarespiral-solenoidal configuration, and a conformal solenoid configuration,are also contemplated. As used herein, the term “conformal” is definedas being similar or identical in form to the shape, contours, and/ortopology of a structure or harmoniously conforming in form to the shape,contours, and/or topology of a structure. The wire of the Tx coil 111may have a cross-sectional shape, such as but not limited to a circularcross-section, a rectangular cross-section, a square cross-section, atriangular cross-section, an elliptical cross-section or combinationsthereof. The wire may comprise copper, gold, silver, aluminum, calcium,tungsten, zinc, nickel, iron, and combinations or alloys thereof, Thewire may further comprise titanium, platinum, iridium, tantalum,niobium, zirconium, hafnium, nitinol, gold, palladium, carbon, andcombinations or alloys thereof, including various stainless steels,platinum-iridium alloys, and Co—Cr—Ni alloys such as MP35N, Havar™, andElgiloy™, Additionally, the wire may be a layered wire, a clad wire, acomposite layered wire, a composite clad wire, a multi-layered wire or amulti-clad wire in any of the above material combinations.

FIG. 2 further shows that the Tx coil 111 is assemblable to a magneticmaterial 102 a, 102 b. The magnetic material 102 a, 102 b may comprise amagnetic material. A magnetic comprises ceramic compounds of thetransition metals with oxygen, which are ferrimagnetic but electricallynonconductive (in other word, an insulating material). The magneticfurther comprises an iron oxide combined with one of nickel, zinc,manganese or combinations thereof. The magnetic material 102 a, 102 bcomprises low coercivity. Low coercivity of the magnetic material meansthat the material's magnetization can easily reverse direction withoutdissipating much energy (that is, hysteresis losses), while thematerial's high resistivity prevents formation of eddy currents in thecore, which is another source of energy loss. The coercivity, also knownas magnetic flux saturation density or B_(sat), of the magnetic materialof the present application is greater than 0.5 Tesla. The magneticmaterial 102 a, 102 b comprises a permeability. Free space haspermeability of μ. equal to μ0. Materials having permeability muchgreater than μ0 concentrates the magnetic flux in the low reluctancepath, hence can be used to contain the magnetic flux in areas where itis required. More importantly, a material with higher permeabilityinduces a higher inductance on a transmitter, and higher inductance on areceiver in close-coupled situations. Higher inductance results in agreater mutual inductance which enables wireless power transfer atlonger ranges, extended distances and larger volumes. The magneticmaterial 102 a, 102 b comprises a permeability 100 to 10,000 dependingon an application's operating frequency. It is contemplated that themagnetic material 102 a, 102 b may be a magnetic shielding material. Themagnetic shielding material may re-direct a magnetic field so it lessensthe field's influence on the item being shielded. The magnetic shieldingmaterial may further facilitate the magnetic field to complete its path.More importantly, the magnetic shielding material redirects, reshapesand/or focuses a magnetic field generated by a wireless Tx system sothat the magnetic field is more concentrated at a distant position or ata spatial volume location at or within which an Rx system resides,thereby enables the wireless Tx system of the present application totransfer more power wirelessly at longer ranges, extended distances andlarger volumes. Such magnetic shielding materials may include, but arenot limited to, zinc comprising magnetic materials such asmanganese-zinc, nickel-zinc, copper-zinc, magnesium-zinc, andcombinations thereof. These and other magnetic material formulations maybe incorporated within a polymeric material matrix so as to form aflexible magnetic pad, sheet or component conformal to the Tx coil 111.Examples of such materials may include but are not limited to, FFSR andFFSX series magnetic materials manufactured by Kitagawa IndustriesAmerica, Inc. of San Jose, Calif., and Flux Field Directional RFICmaterial, manufactured by 3M™ Corporation of Minneapolis, Minn.

FIG. 2 further shows that, in addition to being assemblable to amagnetic material 102 a, 102 b, the Tx coil 111 is further assemblableto an optional bezel 103. As used herein, an assembled Tx coil isdefined as a coil assembly, comprising a Tx coil 111, a magneticmaterial 102 a, 102 b, and an optional bezel 103. A bezel is defined asa structure that holds the Tx coil 111 in place. The bezel may furtherprovide structural integrity to the Tx coil. A bezel may comprise aframe around the Tx coil. The frame may or may not be conformal. Thebezel may comprise a groove and/or a slot. The groove and/or the slotmay be configured to accommodate a wire or wires of the Tx coil, the Txcoil itself or both. The bezel may comprise a rim configured to fastenor hold the Tx coil in place. The bezel may comprise sloping facets toaccommodate a wire or wires of the Tx coil, the Tx coil itself, or both.

While bezel 103 is shown in FIG. 2 as a component of the Tx system 100,it is contemplated that bezel 103 may be physically integrated into ahousing (not shown) of the Tx system 100, or to a housing of an objectto which a Tx system is attached (also not shown). In the latter case,an exemplary embodiment is a housing of a charger, wherein the housingcomprises a bezel that is either a separate construct that is physicallyattached to the housing, such as a charger cover, or is pre-formed as apart of the housing, for example by a stamping, a progressive stampingor a deep-drawing process, or is a molded part of a housing such as byplastic injection molding, metal injection molding, fixture pouredmolding, or other molding processes that shape a pliable material usinga rigid frame to which the pliable material conforms. In this way bezel103 may not only hold in place the Tx coil 111 but may also facilitateTx coil alignment with a power-receiving (Rx) coil. It is alsocontemplated that an assembled Tx system may be physically attached to abezel formed in the housing of a charger, or be affixed to a preformedbezel compartment in the housing using the same methods as described forforming bezel 103.

Another exemplary embodiment is a bezel that is a part of a supportstructure, such as a table, a bench, a stand, a cabinet, or othersimilarly configured support structure, wherein the support structurecomprises a bezel that is physically attached to, machined as part of,carved into, or inserted into said support structure. The bezel may bepositioned on a surface, a wall, an underside, or in an opening made toaccommodate the bezel. It is also contemplated that the supportstructure can comprise an assembled Tx system 100 that is fastened to abezel that is physically attached to, machined as part of, carved into,or inserted into the support structure.

The bezel 103 of FIG. 2 may comprise a metal, an alloy, a plastic, apolymer, a foamed metal, a foamed plastic, a foamed polymer, acomposite, or combinations thereof. Composites, which are made from twoor more constituent materials, have different physical and chemicalproperties, such that when combined, produce a composite material withcharacteristics different from the individual components. The individualcomponents remain separate and distinct within the finished structure.Of significance is that the individual components of the compositematerial may specifically be selected to produce a material withproperties that minimize or even resolve application issues. Hence,composites can be customized to specifically address, for example,thermal management, magnetic field management, magnetic fieldconcentration, electromagnetic interference (EMI) mitigation, noisesusceptibility shielding, weight, cost, magnetic field coupling strength(capture) for broader and/or stronger wireless power transmission, orwireless power transmission at extended distances beyond present-daycapability. It is contemplated that one or more composites may beprovided in the structure, wherein the one or more composites may allembody the same feature, or may all embody a different feature, or mayall embody some combination between all the same feature and alldifferent features. Note that Tx coil 111 may be secured to the Txsystem 100 by other structures or hardware besides bezel 103 withoutdeparting from the scope of the invention.

Referring to FIG. 2 , the Tx coil 111 with magnetic 102 a, 102 b andoptional bezel 103 is shown to be attachable to an optional bracket 105.Bracket 105 may comprise a metal, a foamed metal, an alloy, a foamedalloy, a plastic, a foamed plastic, a polymer, foamed polymer, acomposite or combinations thereof. The composite may be the same ordifferent than the composite of the bezel 103. Similarly to thecomposite of optional bezel 103, the composite of the bracket 105comprises individual components that may specifically be selected toproduce a material with properties that minimize or resolve applicationissues, and can be customized to specifically address similar issues,such as, thermal management, magnetic field management, magnetic fieldconcentration, electromagnetic interference (EMI) mitigation, noisesusceptibility shielding, weight, cost, magnetic field coupling strength(capture) for broader and/or stronger wireless power transmission, orwireless power transmission at extended distances beyond present-daycapability. Similarly to the composite of optional bezel 103, one ormore composites may be provided in the structure, wherein the one ormore composites may all embody the same feature, or may all embody adifferent feature, or may all embody some combination between all thesame feature and all different features. Note that Tx coil 111 may besecured to the Tx system 100 by other structures or hardware besidesbracket 105 without departing from the scope of the invention.

Similarly to optional bezel 103, while bracket 105 is shown in FIG. 2 asa component of the Tx system 100, it is contemplated that bracket 105may be physically integrated into a housing (not shown) of the Tx system100, or to a housing of an object to which a Tx system is attached (alsonot shown). In the latter case, an exemplary embodiment is a housing ofa charger, wherein the housing comprises a bracket that is either aseparate construct that is physically attached to the housing, such as acharger cover, or is pre-formed as a part of the housing, for example bya stamping, a progressive stamping or a deep-drawing process, or is amolded part of a housing such as by plastic injection molding, metalinjection molding, fixture poured molding, or other molding processesthat shape a pliable material using a rigid frame to which the pliablematerial conforms. In this way bracket 105 may not only hold in placethe assembled Tx coil 111 and bezel 103, but may also facilitate Tx coil111 alignment with an Rx coil. It is also contemplated that an assembledTx system may be physically attached to the housing of a charger, or beaffixed to a preformed compartment in the housing using the same methodsas described for forming bracket 105.

Another exemplary embodiment is a bracket that is a part of a supportstructure, such as a table, a bench, a stand, a cabinet, or othersimilarly configured support structure, wherein the support structurecomprises a bracket that is physically attached to, machined as part of,carved into, or inserted into said support structure. The bracket may bepositioned on a surface, a wall, an underside, or in an opening made toaccommodate the bracket. It is also contemplated that the supportstructure can comprise an assembled Tx system 100 that is fastened to abracket that is physically attached to, machined as part of, carvedinto, or inserted into the support structure.

The Tx coil 111 and the magnetic material 102 a, 102 b, with or withoutthe bezel 103 shown in FIG. 2 , may be secured to bracket 105 using anadhesive 104. The adhesive 104 may comprise, a structural adhesive, aself-adhesive, a self-stick adhesive, or a pressure sensitive adhesive(PSA). The adhesive 104 may further comprise a heat spreader tofacilitate heat dissipation. A heat spreader may comprise a body, thebody comprising a pad, a plate, a block, a sheet, a film, a foil, afabric, a screen, a weave, a mesh, a foam, a custom fiber or wire form,or a braid of a high thermal conductivity material. A heat spreader mayalso comprise particulates or particles of high thermal conductivitymaterials in any shape or form, including a sphere, a flake, an oval,trapezoidal, tabular, irregular, dendritic, platelet, a fiber, awhisker, a tube, tubular, angular, symmetric, asymmetric, a pressedpowder, a pressed clump, and combinations thereof. High thermalconductivity materials include silver, copper, gold, brass, aluminum,iron, steel, various carbons including graphite, graphene, diamond,pyrolytic graphite and fullerenes, and combinations or alloys thereof.It is contemplated that a heat spreader may comprise any body, alone orcombination with another different body, in combination with one or moreparticulate or particle options. The Tx coil 111 may alternately beassembled to the bracket 105 using an epoxy, a thermal epoxy, a tape, aglue, a thermal paste or any adherence medium that is applied to onesurface, or both surfaces, of two separate items so that the adherencemedium binds them together and resists their separation. The adherencemedium may also further comprise a heat spreader to facilitate heatdissipation. Also, alternatively, the Tx coil 111 may be assembled tothe bracket 105 using fasteners, the fasteners comprising screws,staples, nails, Velcro, or combinations thereof. It is contemplated thatany adherence medium, alone or combination with another differentadherence medium, may be used in combination with one or more fasteneroptions.

A circuit board 107 is also assemblable to the bracket 105. Assembly isshown using a thermal gasket 106. A thermal interface material may beused instead of the thermal gasket 106. A thermal interface material isany material that is inserted between two components in order to enhancethe thermal coupling between them. The thermal gasket 106 (oralternately, the thermal interface material) may also may comprise anyone of the heat spreaders disclosed above, alone or in combination, tofacilitate heat dissipation. The circuit board 107 may optionally befitted with an additional high thermal conductivity material between thecircuit and the bracket so that heat may be extracted from the circuitboard and/or circuit board components for dissipation by the bracket105. Any one of the high thermal conductivity materials previously namedmay be used alone or in combination thereof for this purpose.Additionally, the added high thermal conductivity material between thecircuit board and the bracket may optionally be used with or without thethermal gasket 106. A thermal gasket is herein defined as a componentwhich is specifically designed to function in areas of a structure thatgenerate heat. The thermal gasket 106 may be fabricated in a number ofways. For example, the thermal gasket may be cut using a die.Alternatively, the thermal gasket may be cut without using a die, inother words, a dieless cut. Cuts can comprise a standard form, or can becustom-made to form the thermal gasket 106 from one of a cured thermaladhesive, paste, resin or elastomer, a thermal composite, a thermalinterface material, a gap pad, a filter pad, and combinations thereof.Furthermore, the thermal gasket 106 made be cut from any shapeablematerial capable of attaching, separating and/or sealing two surfaces inan apparatus or device. In addition to cutting, the thermal gasket canbe made by stamping or punching. The thermal gasket can also be made bymolding a flowable material that is then cured. The thermal gasket 106may comprise polyurethane, silicone, foam, sponge, rubber,polytetrafluoroethylene (PTFE), or combinations thereof. Additionally,any of the above named materials may be used in combination with any ofthe previously high thermal conductivity materials named. Additionalcommercially available non-limiting examples of potential thermal gasketmaterials include PORON® polyurethane gaskets, BISCO® silicone gaskets,3M™ thermal gaskets, Porex® PTFE gaskets, Nomex® insulator gaskets, orFormex® Insulator gaskets, any of which might further be customized toenhance thermal conductivity by way of a heat spreader, a reflectivefoil, and interface material, a lining or the like. The circuit board107 may alternately be assembled to the bracket 105 using an epoxy, athermal epoxy, a tape, a glue, a thermal paste or any adherence mediumthat is applied to one surface, or both surfaces, of two separate itemsso that the adherence medium binds them together and resists theirseparation. The adherence medium may also further comprise a heatspreader to facilitate heat dissipation. Also, alternatively, thecircuit board 107 may be assembled to the bracket 105 using fasteners,the fasteners comprising screws, staples, nails, Velcro, or combinationsthereof. It is contemplated that any adherence medium, alone orcombination with another different adherence medium, may be used incombination with one or more fastener options, or any one or morethermal gaskets 106.

Also shown in FIG. 2 is an electrically insulating material 101assembled atop the Tx coil 111. The insulating material 101 may compriseone of a polyimide, an acrylic, glass, fiberglass, rubber, polyester,polyether imide, polytetrafluoroethylene, polyethylene,polyetheretherketone (PEEK), polyethylene napthalate, polyvinyl chloride(PVC), fluoropolymers, copolymers, a ceramic material, a magneticmaterial, a laminate, a resin, papers and films, a foam material, asilicone, a sponge, a rubber, a soft ceramic-filled silicone elastomerwith or without a liner, a silicone coated fabric or mesh, orcombinations thereof. A foam material may further comprise, a hightemperature silicone foam, an open-cell foam such as, but not limitedto, a polyurethane, a reticulated polyurethane foam, a closed cell foamsuch as, but not limited to, polyethylene, a cross-linked polyethylenefoams, or combinations thereof. The electrically insulating material 101may further be either thermally insulating, for example, if contactableby a user, or thermally conducting depending on an application'srequirements. The electrically insulating material 101 may also bereflective, wherein the electrically insulating material comprises afoil capable of reflecting radiant heat. The insulating material 101 mayencapsulate an assembled Tx coil, the assembled Tx coil comprising amagnetic 102 a, 102 b, wherein the magnetic may be a magnetic shieldingmaterial. Encapsulation of the assembled power Tx coil thereby providesprotection against damage potentially imparted said coil assembly by,for example, shock, vibration, impacts and drops.

FIG. 3A shows a perspective view of the assembled Tx system 100 of FIG.2 , showing a top end and a bottom end of screws 109 a and 109 b afterfastening.

FIG. 3B shows a magnified cross-sectional view of a portion of the Txsystem 100 of FIG. 3A. Visible is a portion of the bezel 103, a portionof the bracket 105, a portion of the thermal gasket 106, a portion ofthe circuit board 107, a metal spring washer 108 a and a screw 109 a.The screw 109 a is shown passing through a hole extending through thecircuit board 107 and the bracket 105 and engages the threading in thehole of the bezel 103. Prior to fastening, the hole of the circuit board107, the bracket 105 and the bezel 103 are aligned. The screw isinserted into the aligned vias or holes and secured to a washer 108 a,thereby fastening the circuit board 107, the bracket 105 and the bezel103 one to another as shown. The metal spring washer 108 a, whenflattened, provides a preload force preventing the screw 109 a frombacking out of the bezel 103. A spring force also allows the metalspring washer 108 a to electrically connect the screw 109 a, the circuitboard 107 and the bracket 105, ensuring a continuous ground path betweenthe bracket 105 and the circuit board 107. In this embodiment, thethermal gasket 106 comprises a thermally conductive and an electricallyinsulating material. The thermal gasket 106 thermally connects thecircuit 107 to the bracket 105, providing a continuous thermal path forthe heat generated by the circuit board 107 and/or its components to beconducted for dissipation by the bracket 105. This is important forproper thermal management of the Tx system 100 during operation.Additionally, the fastened assembly comprises a single connection,wherein the single connection is, simultaneously, structurally,electrically and thermally connecting the circuit board 107 and thebracket 105. Thermally connected is herein defined as a path or linethrough which heat flows. Thermally connected structures may comprise apath or line having two or more points or bodies through which heat isconducted. Additionally, a thermally connected structure may comprise aconstruction, the construction comprising two or more point-to-point orbody-to-body connections.

FIG. 4 is a top view of the assembled Tx system 100 of FIG. 3A.

FIG. 5 is a bottom view of the Tx system 100 of FIG. 3A showing thecircuit board 107. The circuit board of the present application is aconstituent of the Tx system 100 comprising a structure that allowsassembly of one of an electrical circuit, a data circuit, or both ineither a printed circuit board configuration, a multi-layer printedwiring board, or a point-to-point construction board. Furthermore, theelectrical and the data circuits of the circuit board may be capable oftransmitting a combination of electrical energy, electromagnetic energy,electrical power and electronic data together or separately. The circuitboard of the present application may also comprise componentnon-limiting elements such as inductors, capacitors, resistors,switches, heat sinks, thermal relief structures, thermal relief pads,band pass, high pass and low pass filters and the like. The circuitboard may also comprise an LC tank. The LC tank is defined as aninductor and a capacitor, or mechanical equivalents such as a crystal orMEMS oscillator, to make a circuit that is responsive to frequency. TheLC tank may comprise an LC circuit. The LC circuit may comprise either ahigh impedance or a low impedance at a resonant frequency. The LC tankor the LC circuit may operate as a bandpass filter, a band stop filter,or an oscillator. Additionally, circuit board components may comprisethe multi-layer wire or the multi-layer multi-turn technology of U.S.Pat. Nos. 8,567,048, 8,610,530, 8,653,927, 8,680,960, 8,692,641,8,692,642, 8,698,590, 8,698,591, 8,707,546, 8,710,948, 8,803,649,8,823,481, 8,823,482, 8,855,786, 8,860,545, 8,898,885, 9,208,942,9,232,893, 9,300,046, 9,306,358, 9,439,287, and 9,444,213, incorporatedfully herein by reference. The circuit board of the present applicationmay be a coil circuit board or a main Tx system circuit board, eithereach constructed separately or constructed within a single, unitarycircuit board configuration. More than one circuit board of any typeand/or combination may be physically and/or electrically connected by aconnector, the connector comprising one of a via, a solder, a tab, awire, a pin, a screw or a rivet.

FIG. 6A shows a first side view of the assembled Tx system 100 of FIG.3A. Coil connection ends 112 are shown on the left of the first side ofFIG. 6A

FIG. 6B shows a second side view of the assembled Tx system 100 of FIG.3A. Coil connection ends 112 are shown on the left of the first side ofFIG. 6A

FIG. 6C shows an end view of the assembled Tx system 100 of FIG. 3A. Thecoil connection ends 112 are present on the opposite end of theassembled Tx system end view being shown.

FIG. 7 is a cross-sectional view taken from section 7-7 of the assembledTx system of FIG. 6B (coil end connections 112 are not present in thiscross-section). The wire of Tx coil 111 shows a circular shape, however,as previously mentioned the wire of the Tx coil can be of various othercross-sectional shapes.

FIG. 8 shows a cross-sectional view of an embodiment of a Tx system 200with thermal management features. Shown are: a front housing 201, an airgap 202, a foam 203, a Tx coil 204, a magnetic material 205, a two-piecebracket 206 comprising a bracket top component 206 a and a bracketbottom component 206 b, a circuit board 207, and a back housing 208. Inthis embodiment, the foam 203 is an electrically insulating material. Itis contemplated that any of the electrically insulating materials 101previously named may alternately be used instead of the foam 203. Thefoam 203 or an alternate electrically insulating material may also bethermal insulating or a thermal conducting depending on the application.If the front housing 201 is contactable by a user, then a thermalinsulating foam may be selected, so that when contact is made by theuser, the user is not subjected to any discomfort that may occur as aresult of a front surface elevated temperature when the Tx system 200 isin operation. If the front housing 201 is not contactable by a user, butinstead exposed to an environment 200, then a thermal conducting foammay be selected, so that any heat generated when the Tx system 200 is inoperation can be dissipated to the environment 200.

Also shown in FIG. 8 is an optional mounting plate 209. The optionalmounting plate 209 may provide support for the Tx system 200, may mountthe Tx system 200 to an object, such as, but not limited to, a holder,or may dissipate heat generated by the Tx system 200 and/or itscomponents to a surrounding environment 210.

The arrows depicted in the magnetic 205, the circuit board 207, and theback housing 208 of FIG. 8 are exemplary indicating directional heatflow. More specifically, the exemplary arrows of magnetic 205 indicatehow heat may be dissipated from the Tx coil 204 to the bracket topcomponent 205 a. Similarly, the exemplary arrows depicted in circuitboard 207 indicate how heat may be dissipated from the circuit board 207and/or its components to the bracket top component 205 a. Likewise, theexemplary arrows depicted in the back housing 208 indicate how heat maybe dissipated from the bracket bottom component 206 b to the optionalmounting plate 209, and then from the optional mount plate 209 to thesurrounding environment 210. It is understood that, in the absence ofthe optional mounting plate, the exemplary arrows depicted in the backhousing 208 would indicate that the heat may be dissipated from thebracket bottom component 206 b to the surrounding environment 210.Materials for use in dissipating heat should have high thermalconductivity. Non-limiting examples include: silver, copper, gold,brass, aluminum, iron, steel, various carbons including graphite,graphene, diamond, pyrolytic graphite and fullerenes, and combinationsor alloys thereof. As previously disclosed, composites may also be used.Non-limiting examples include metal matrix composites (MMCs) comprisingcopper-tungsten, AlSiC (silicon carbide in aluminium matrix), Dymalloy(diamond in copper-silver alloy matrix), and E-Material (beryllium oxidein beryllium matrix).

FIG. 9A shows a perspective view of an embodiment of a T-shape magneticmaterial comprising two components, a magnetic core 102 a and a magneticbacking 102 b. The magnetic core 102 a and the magnetic base 102 b maybe formed by using an adhesive or an epoxy, Alternately, the magneticcore 102 a and a magnetic backing 102 b may be formed by pressing apowder into a mold to obtain the desired shape, followed by a sinteringprocess. Yet another way to form the magnetic core 102 a and a magneticbacking 102 b is to assemble, then press and/or sinter multiple layersof sheet magnetic. The T-shape magnetic material alternately maycomprise a single material construction, wherein a portion of theT-shape magnetic material comprises the magnetic core as a projectionextending from the magnetic base. In the single material constructionthe magnetic core projection may be formed extending from the magneticbase from a single starting magnetic material piece. The same alternateprocesses disclosed above may be used to form the single materialconstruction T-shape magnetic material. In the T-shape embodiment shown,the magnetic core 102 a is concentrically positioned atop a magneticbacking 102 b. It is understood, however, that a magnetic core may bepositioned off-center atop the magnetic backing. It is furthercontemplated that more than one magnetic core may be positioned atop asingle magnetic backing. It is also contemplated that either themagnetic core 102 a, the magnetic base 102 b, or both may comprise oneor more magnetic materials. The one or more magnetic materials may bethe same for both or each may have different magnetic materials. The oneor more magnetic materials may further be planarly layered in either themagnetic core 102 a, the magnetic base 103 b, or both; arranged alongthe a longitudinal or z-axis with layers extending outwardly in a radialdirection if circular or oval or other such round surface defined byradii, or in an x or y axis direction if shaped other than a circular orround or radially defined.

FIG. 9B illustrates an exploded perspective view of the magneticmaterial embodiment of FIG. 9A in relation to a bracket 105. The bracket105 may comprise one of an electrical shielding material, a heatconduction material, a heat dissipation material, an electricalgrounding structure, or combinations thereof.

Regarding electrical grounding, it is important for any circuit board107 in the Tx system 111 to be electrically grounded. The electricalgrounding structure as part of the bracket 105 is a convenient groundingoption. For example, referring once again to FIG. 3B, the metal springwasher 108 a is shown with the screw 109 a. The threads of the screw 109a pass through a hole extending through the center of said washer. Inthis embodiment, screw 109 a is a capture screw. This cross-sectionalview shows, to the right and to the left of the imaginary center line ofthe screw 109 a, that the screw threads have captured the edge of thehole of said washer. Capture of the edge of the hole of said washerresulted in a portion of said washer to be angularly bent from itsas-manufactured planar configuration. Also visible in thiscross-sectional view is the outer edge of the metal spring washer 108 a.The outer edge of the metal spring washer 108 a, which includes theentire outer edge perimeter, is shown sandwiched between the circuitboard 107 and the bracket 105. This cross-sectional view illustrates themetal spring washer edge as a flat end that extends to the circuit board107 and the bracket 105, wherein the extension is initially flat, andthen exhibits the angular bend that eventually positions the hole edgeat a thread of screw 109 a. To the right of screw 109 a, the thermalgasket 106 is also shown sandwiched between the circuit board 107 andthe bracket 105. When the capture screw with its washer intentionallyelectrically connects a ground plate of the circuit board 107 to thebracket 105, then the circuit board is grounded to said bracket.Grounding the bracket to the circuit is essential in mitigatingelectrostatic discharge (EDS) and potentially dangerous arcing events.Similarly, sandwiching of the thermal gasket 106 between the circuitboard 107 and the bracket 105 thermally connects said circuit board tosaid bracket, thereby enabling heat that may be generated in the circuitboard and/or circuit board components to be conducted away from saidcircuit board to bracket for eventual dissipation. The embodimentsdisclosed above are only one way to electrically ground and/or thermallyconnect the circuit board 107 to the bracket 105. There are otherconfigurations to electrically ground and/or thermally connect thecircuit board 107 to the bracket 105 without departing from the scope ofthe invention.

Also visible in the bracket 105 of FIG. 9B are notches 105 a, 105 b, and105 c. The notches shown are only one possible embodiment. Pending theapplication, the bracket notches can be positioned in any shape and anymanner within the bracket or around the perimeter of the bracket. Insome embodiments, the notches may be positioned to manage thedevelopment of eddy currents due to current passing through an antennacoil. Eddy currents that develop in a metal shield reduces theinductance of the Tx coil thereby introducing losses which subsequentlydecreases the Quality factor of the Tx coil. A notch or notches helps inthat the presence of a notch causes the path of an eddy current to bemodified. The eddy current flows opposite the direction of the currentflow of the Tx coil and also flows in close proximity to the notch so asto maintain the eddy current loop. Hence, the magnetic fields created bythe eddy current at the notch area will cancel each other. The presenceof notches in conjunction with a shielding material mitigates much ofthe effect the eddy current might have on the Tx coil. Additionally, thecontinuity of the shield is essentially left intact. So, even though thenotch exists, there is enough continuity retained by the shield forsufficient EMI shielding to be sustained. It is known that the magneticfields of a Tx coil typically couple to the EMI metal shield even-thoughthe magnetic shield is present to prevent coupling. For coupling not tooccur, the dimensions of the magnetic shield would have to be infinite.Consequently, the notches in the shield result in a smaller overall areadirected toward EMI shielding, which means less magnetic fields willcouple, and less eddy current will flow, which, as previously disclosed,normally flows opposite to the direction of the current flow of thecoil. There are other notch configurations of said bracket other thanthe one shown in this embodiment to manage the operation of the Txsystem 100 without departing from the scope of the invention.

FIG. 9C illustrates a perspective view of the magnetic material 102 andthe bracket 105 after assembly.

FIG. 9D is a perspective top view of an E-core magnetic materialembodiment. This embodiment comprises a magnetic core 400 a, a magneticbacking 400 b, and a magnetic ring 400 c. The magnetic ring 400 c isspaced inwardly from the outer edge of the magnetic backing 400 b andprojects in an upward direction from the top surface said magneticbacking. The magnetic core 400 a and the magnetic ring 400 c function todirect and focus magnetic fields, hence improving coupling with areceiver coil. Also, magnetic ring 400 c provides a low-resistance paththrough which magnetic fields are directed, limiting an amount ofmagnetic flux that would otherwise pass through nearby metal components.This type of embodiment minimizes formation of eddy currents which couldotherwise counteract a transmitter's magnetic field and limit magneticfield strength.

FIG. 9E is a perspective view of an alternative E-core magnetic materialembodiment. In this embodiment, instead of magnetic ring 400 c spacedinwardly from the outer edge of the magnetic backing 400 b, shown is aring-like wall 400 c′ at the perimeter of the outer edge of the magneticbase 400 b.

FIG. 9F is an exploded perspective view of a Tx coil 401 and theembodiment of the E-core magnetic material 400 c′ of FIG. 9E.Illustrated is a Tx coil 401, which (due to its shape) creates amagnetic field when an electric current passes through it. Here, saidcoil 401 is positioned above a magnetic combination which comprisesmagnetic core 400 a, magnetic backing 400 b, and magnetic ring 400 c.The magnetic combination functions to help direct and concentratemagnetic fields created by coil 401, and can also limit side effectsthat would otherwise be caused by magnetic flux passing through nearbymetal objects.

FIG. 9G is a perspective view of an Rx coil 501 and the embodiment ofthe E-core magnetic 400 c′ of FIG. 9F after assembly. The Rx coil 501comprises coil sections 501 a and 501 b, which are connected to oneanother forming a multi-coil assembly. Note that the coil section 501 bis positioned about the magnetic core 400 a and on the magnetic backing400 b (not visible). The coil section 501 a is at least partiallypositioned on top surface of the ring-like wall 400 c′, and, sincepositioned on the top surface of the ring-like wall 400 c′, resides at ahigher level than does the coil section 501 a. In the embodiment, themagnetic structure affects magnetic flux conduction and concentration.Thus, a magnetic field generated by coil section 501 a will be directedcentrally, and will allow higher coupling with small receivers atextended z-distances. Also, a magnetic field generated by coil section501 will be affected by the magnetic structure that increases couplingand charging distance. Additionally, the magnetic structure enableslarger power-transfer spatial ranges, such as required by larger volumeapplications. The larger power-transfer spatial range permits moreeffective functioning with receivers which are, for instance, offset inan x-y plane as well as in a z-direction.

FIG. 9H illustrates an actual simulation of the magnetic field generatedby the Tx coil 401 of FIG. 9F and captured by a standard Rx phone coilat an extended distance. The standard Rx phone coil was modelled with ametal piece behind the coil. The metal piece was used to simulate abattery. The simulation shows that the magnetic field generated by theTx coil 401 was captured by the Rx phone coil at an extended z-distanceof 9 mm. As discussed previously, Qi′ wireless Tx systems typicallyoperate between coil-to-coil distances of 3 mm-5 mm. Theshaped-magnetics of the present application have shown to favorablyreshape a magnetic field so that coil-to-coil coupling can occur atextended z-distances, wherein the z-distances are extended about 2 timesto about 5 times the distance of present day Qi′ wireless Tx systems.Furthermore, the shaped-magnetics of the present application can extendcoupling of present day a Qi′ wireless Tx system a z-distance rangingabout 5 mm to about 25 mm. The magnetic may comprise one of a T-coreshape, an E-core shape, a custom shape, or combinations thereof. Any ofthe T-core, E-core and custom shapes previously discussed maysuccessfully be used to reshape the magnetic field for extendedz-distance coupling by a minimum of a 5% compared to standardpresent-day transmitters. In addition, any of the T-core, E-core andcustom shapes previously discussed, each in conjunction with itsrelation to a coil to the magnetic has also may further increasez-direction coupling by at least another 5%. An embodiment comprising astructure, the structure comprising a coil and a magnetic material,wherein a gap between the coil and the magnetic material residing at theinner diameter of the coil comprises 2 mm, reshapes the magnetic fieldso that coupling increases by 5%. Another embodiment comprising astructure, the structure comprising a coil and a magnetic material,wherein a gap between the outer perimeter edge of the coil and themagnetic material residing beneath the coil comprises 2 mm, reshapes themagnetic field so that coupling also increases by 5%. The magneticmaterial may comprise a magnetic body. The magnetic body may furthercomprise a single, unitary constituent, the single unitary constituentfurther comprising one or more structural components.

FIG. 10A is an image of an embodiment illustrating an actual magneticmaterial 102 a, 102 and a Tx coil 111. The Tx coil 111 comprises one ormore connection ends 112, the one or more connection are bent at a 90°angel. The connection ends 112 are pre-bent at 90° prior to assembly tothe magnetic material 102 a, 102 b. While FIG. 10A shows the connectionends 112 of the Tx coil 111 to be bent 90°, it is contemplated that saidconnection ends may be pre-bent at any angle that facilitates assembly.For example, said connection ends may alternatively be pre-bent at a 70°angle up to a 110° angle. The connection ends 112 may attached to thecircuit board (not shown) by either a manual or a reflow solder process.The connection ends 112 may optionally be tinned to facilitatesolderability. Bending the connection ends 112 allows placement of thebent ends into the circuit board 107 via or hole, which eliminates anyneed for coil wire routing, or the need for service loop options inorder to achieve circuit board connection. Circuit board via or holeconnection adds strength to the connection, making the connection moreresilient to shock, vibration, impacts and drops, thereby enhancingdurability of the Tx system 100. Additionally, circuit board via or holeconnection results in a smaller assembly footprint.

FIG. 10B is a magnified image of the connection end portion of theembodiment of FIG. 10A attached to an actual circuit board 107 andbracket 105 assembly.

FIG. 10C is the same image as FIG. 10B except that the image has beenannotated to accentuate the coil connection ends 112 to the circuitboard 107 and bracket 105 assembly. The image shows the connection ends112 soldered to plated holes 107 a, 107 b of the circuit board 107.

FIG. 11A is an image of an end view of a power-receiving (Rx) system1100. Shown is power-receiving (Rx) electronics 1101 and apower-receiving (Rx) coil 1111.

FIG. 11B is an image of a side view of the Rx system 1100 of FIG. 11A.In this view, the Rx electronics 1101 is on the right of the image, andthe Rx coil 1111 is more clearly visible at the top of the Rx system.This embodiment of the Rx system comprises a battery pack 1121. Thebattery pack comprises two batteries 1121 a and 1121 b. At the bottom ofthe Rx system 1100 is a cover 1130.

FIG. 12 is an exploded perspective view of an embodiment of an Rx coil1200 of the present application. This embodiment is exemplary of the Rxcoil 1111 of the Rx system 1100 of FIG. 11B. The components of the Rxcoil 1200 shown are: an adhesive 1210, a flexible printed circuit (FPC)Rx coil 1211, a magnetic material 1212, and a spacer 1213. The Rx coil1200 follows a layered arrangement, wherein the layers are arranged,beginning with a top layer and ending with a bottom layer, in thefollowing order: the top layer is an adhesive 1210, which is a firstadhesive layer, followed by the FPC Rx coil 1211, which is followed bythe magnetic material 1212. Following the magnetic material 1212 is theadhesive 1210, which is a second adhesive layer. The second adhesivelayer is followed by the spacer 1213. The bottom layer is the adhesive1210, which is a third adhesive layer. Thus the Rx coil 1200 of FIG. 12comprises a total of six layers. Note that the FPC Rx coil 1211 issandwiched between the adhesive 1210 and the magnetic material 1212, theadhesive 1210 comprising the first adhesive layer positioned atop theFPC Rx coil and the magnetic material 1212 positioned beneath the FPC Rxcoil. Further, the FPC Rx coil 1211 with the magnetic material 1212 issandwiched between the adhesive 1210, the sandwiching adhesivecomprising a first adhesive layer and a second adhesive layer. Thisparticular arrangement allows the coil to be mechanically affixed to afront housing, minimizing distance between transmitter coil and receivercoil. Having the magnetic material 1212 directly behind the Rx coil 1111also reduces the distance between Tx magnetic material and Rx magneticmaterial, thereby boosting power transfer system performance andtransmitter-receiver coupling. Also note that the spacer 1213 issandwiched between the adhesive 1210. In this case the spacer 1213 issandwiched by the second adhesive and third adhesive layers. In thisembodiment, the spacer 1213 is used to separate the Rx coil 1211 withthe magnetic material 1212 and a battery or a battery pack (not shown).An advantage of this arrangement is two-fold: (1) such an arrangementallows for a thinner construction when available space is limited; and,(2) this arrangement reduces equivalent series resistance (ESR) of theRx coil 1211. Reduced ESR improves the quality factor of said coil. Thequality factor affects wireless power transmission efficiency, andinfluences wireless transmission distances, i.e., the transmissionrange. Additionally, such an arrangement makes restricted physicalorientations of a power-receiving apparatus or device (which arerequired by present-day wireless transmission systems in order toachieve optimal, complete and uncorrupted wireless power transmission)unnecessary. Other embodiments may alternately comprise one or morespacers, wherein each spacer comprises the same thickness, shape, and/orsize. Yet other embodiments may alternately comprise one or morespacers, wherein at least one of the one or more spacers comprises athickness, a shape and/or a size that differs. In some embodiments, themagnetic material 1212 alternately comprises one of a magnetic material,a ferromagnetic material, a magnetic shielding material, a metalshielding material, a metal shielding material with patterned cuts, anEMI shielding material, an amorphous material, a nanocrystallinematerial, a composite material, a material having coercivity greaterthan 0.5 Tesla, a material having permeability ranging between 100μ′ to10,000μ′, or combinations thereof. An embodiment without the magneticmaterial 1212 is contemplated. Additionally, the flexible printedcircuit (FPC) Rx coil 1211 may alternately comprise any coil wirepreviously disclosed. The adhesive 1210 may comprise any adherencemedium previously disclose. The adhesive 1210 and any alternateadherence medium may further comprise a heat spreader, the heat spreadercomprising any of the previously list heat spreader materials disclosed.The Rx coil 1200 may further comprise one or more filters. The one ormore filters may be a special type of filter, such as, but not limitedto, a comb filter.

FIG. 13 is a schematic showing the constituents of an optionalelectrical circuit 1300 of a Tx system 100, 200. Here, a full bridgeinverter 1301 is used to convert DC power to AC in order to drive a Txcoil. Voltage of the full bridge inverter 1301 can be varied to change alevel of transmitted power. In an embodiment, an operating frequency maybe kept fixed. It is contemplated that a half-bridge inverter may bealternately used in some embodiments.

FIG. 14 is an image of a prior art standardized MP-A2 Tx coil 10, whichis often used for Qi™-compatible wireless power applications. Shown isthe Tx coil wire structure 11 and a shielding 12 positioned beneath theTx coil wire structure 11.

FIG. 15 is an image of a prior art standardized A11/MP-A11 Tx coil 20,which is also often used for Qi™-compatible wireless power applications.Shown here is a Tx coil wire structure 21 and a shielding 22 positionedbeneath the Tx coil wire structure 21. In this embodiment the shielding22 is a T-shape comprising a shielding core 22 a and a shielding base 22b.

FIG. 16 is an exploded perspective view of an embodiment of a Tx system1600 with thermal management features. The constituents shown include afoam 1601, a Tx coil 1602, a magnetic 1606, an adhesive 1603, a heatdissipater 1604, a shield 1608 and a circuit board 1605. In thisexemplary embodiment, the heat dissipater 1604 comprises two portions1604 a, 1604 b, each portion comprising heat dissipating fins 1604 c. Itis contemplated that the heat dissipater 1604 may take any formassemblable to a Tx system. The heat dissipater 1604 may comprisemultiple components, each constructed separately and then assembled; or,alternatively, the heat dissipater 1604 may comprise a singleconstruction, the single construction manufactured from a singlematerial body. The fins 1604 c of the heat dissipater 1604 increase asurface area on said dissipater, which facilitates heat dissipation to aconstituent of the Tx system 1600 and/or to a surrounding environment(not shown). In this exemplary embodiment, heat may be dissipated fromthe circuit board 1605 and/or its components to either a constituent ofthe Tx system 1600 and/or to a surrounding environment (not shown). Theheat dissipater 1604 is assemblable to the shield 1608. Alternatively,the heat dissipater 1604 and the shield 1608 may comprise a singleconstruction, the single construction manufactured from a singlematerial body.

FIG. 17 is taken from 17-17 of FIG. 16 , illustrating a cross-section ofthe assembled Tx system 1600 embodiment. In this cross-section, anexemplary optional thermal interface material 1607 is shown in additionto all of the elements of FIG. 16 . Also, the heat dissipater 1604 andthe shield 1608 of FIG. 16 are shown in this cross section as a singleconstruction heat dissipater 1604′. Regarding the optional thermalinterface material 1607, it is contemplated that one or more of thethermal interface materials previously disclosed may alternatively beused. Further, the optional thermal interface material 1607 may compriseany of the shapes or configurations previously disclosed. In thisexemplary embodiment, each optional thermal interface material 1607shown is sandwiched, in other words, positioned between, a component ofthe circuit board 1605 and the magnetic 1606, so that the thermalinterface material 1607 may conduct heat from a heat-generatingcomponent of the circuit board 1605 to the heat dissipater 1604′,wherein the heat dissipater 1604′ conducts the heat generated by thecomponent for dissipation to another constituent of the Tx system 1600and/or to a surrounding environment (not shown).

FIG. 18 is an exploded perspective view of constituents of a portion ofthe exemplary embodiment of the assembled Tx system 1600 of FIG. 16 . Inthis embodiment, the optional thermal interface material 1607 is shownin four places. There are three thermal interface materials 1607 a, 1607b, 1607 c each atop a component of the circuit board 1605. A fourthoptional thermal interface material 1607 d is shown underneath circuitboard 1607. Thermal interface materials 1607 a, 1607 b, 1607 c conductheat from a heat-generating component of the circuit board 1605 to theshield 1608. Thermal interface material 1607 d conducts heat from thecircuit board 1605 to either a constituent (not shown) of the Tx system1600 and/or to a surrounding environment (also not shown).

It will be understood to those skilled in the art that there are anumber of other ways to position optional thermal interface material1607 in the Tx system 1600 in addition to the embodiments shown in FIGS.16, 17 and 18 .

FIG. 19 is similar to FIG. 18 , except that this exploded perspectiveview includes a Tx coil assembly. The Tx coil assembly shown comprises aTx coil 1602 and a magnetic 1606, wherein the magnetic is an E-coremagnetic. The Tx coil 1602 is a multi-layer coil comprising at least twocoils. It is contemplated that the number of coil layers can be as manyas required by the application and/or that fits within the space allowedby the device or apparatus. It is also contemplated that the magnetic1606 can alternatively be a T-core magnetic or any magnetic shapeassemblable to the heat dissipater 1604. The magnetic 1606, may also bea magnetic shielding material. The magnetic may alternately be ametallic shield. The metallic shield provides both EMI and magneticshielding. The magnetic shield also provides conduction of heat that maybe generated by the coil during operation. As such, the metal shieldacts like a heat sink, absorbing the heat from the coil, and thendispersing the heat away from the coil to avoid and/or mitigate systemover-heating. Similarly, the metal shield additionally providesconduction of heat that may be generated by the circuit board and/or thecircuit board components during operation absorbing the heat from thecircuit board and/or the circuit board components, and then dispersingthe heat away from said circuit board and/or said components.

FIG. 20 is a perspective view of the Tx system 1650 of FIG. 19 afterassembly. The Tx system 1650 is capable of wireless power transmissionat extended distances while effectively dissipating heat generated bythe system during operation.

FIG. 21 is an exploded perspective view of an embodiment of a Tx coilassembly 2100 comprising a Tx coil 2101, a magnetic 2102, and a bezel2103. The bezel 2103 may alternately be a brace or a holder. In thisview, the Tx coil 2101 is assembled to the magnetic 2102. The Tx coilalso has coil ends 2104 that extend a distance from the edge of themagnetic 2102. It is contemplated that the Tx coil 2101 may comprise anyshape and/or any wire previously disclosed. The magnetic 2102 may alsocomprise a T-core, an E-core, or any shape previously disclosed. Themagnetic 2102 may further comprise any of the alternate materialspreviously disclosed. The bezel 2103 is an open holder, meaning there isno floor or base to the surrounding wall of said holder. The bezel 2103is also configured to accept the configuration of the outermost shape ofthe coil/magnetic assembly, which, in this embodiment, is the magnetic2102. The bezel 2103 may comprise one of an insulating material, amagnetic shielding material, an EMI shielding material, a magnetic, aplastic, a polymer, a composite, a glass, a ceramic, a metal orcombinations thereof. While the bezel 2103 in FIG. 21 is shownconfigured to accept the magnetic configuration of the Tx coil, it willbe understood by those skilled in the art that the bezel 2103 mayalternately comprise either a flat configuration, a base, or a shape notconformal to the Tx coil assembly.

FIG. 22 is a perspective view of the constituents of FIG. 21 afterassembly. The Tx coil assembly 2100 shown comprises a coil comprisingextended leads. The extended leads of the coil facilitate accuracy inpositioning the Tx coil assembly within a Tx system. A Tx systemcomprising Tx coil assembly positional accuracy favorably influenceselectrical performance while maintaining a good mechanical stability.The bezel 2103 further ruggedizes the Tx coil assembly 2100. The bezel2103 may also provide thermal management of any heat generated by thecoil 2101 during operation. The bezel 2103 may comprise any of thematerials, components, features, configurations previously disclosed.

The Tx coil assembly 2100 may comprise a single coil, a multi-layercoil, a multi-tiered coil, or combinations thereof. Any combination ofcoil configurations of the Tx coil assembly 2100 previously disclosedmay reside on one or more planes. A multi-layer coil or a multi-tieredcoil may further comprise a first coil part positioned within a firstplane and a second coil part positioned within a second plane. In someembodiments, a multi-layer or multi-tiered coil is an antenna configuredto transfer power, energy and/or data wirelessly. The connections endsof any Tx coil assembly 2100 configuration itself, or of the Tx coilassembly 2100, may comprise one or more extended connection ends,wherein a portion of at least one of the extended connection endscomprises an insulating material. The insulating material may further beconfigured to surround only the at least one extended connection end. Inthis case, the insulating material does not surround any portion of thecoil structure. At least one of the one or more conductors of the singlecoil, multi-layer coil, multi-tiered coil or combinations thereof maycomprise a wire, the wire being one of the configurations as previouslydefined herein, and the wire being positionable on, at, near or adjacenta magnetic material. One or more single coil, multi-layer coil,multi-tiered coil or combinations thereof may comprise a first coilportion positioned on, at, near or adjacent a first magnetic material,and a second coil portion positioned on, at, near or adjacent a secondmagnetic material. One or more single coil, multi-layer coil,multi-tiered coil or combinations thereof may comprise a coil portionpositioned on, at, near or adjacent n-number of magnetic materials. Themulti-layer and multi-tiered coils may be connected in series, mayreside in one or more horizontal planes, or both. Some embodimentscomprise either a Tx coil, an Rx coil, or both, wherein the Tx coil, theRx coil, or both comprise one of a single coil, a multi-layer coil, amulti-tiered coil, or combinations thereof, wherein the Tx coil, the Rxcoil, or both are positioned on, at, near or adjacent one of a magneticmaterial, a magnetic material comprising multiple pieces, or one or moremagnetic materials. The magnetic material comprising multiple pieces,the one or more magnetic materials, or both, may further comprise thesame material or two or more different magnetic materials.

FIG. 23A is a block diagram for an embodiment of a multiple devicewireless power transfer system 2300A, wherein a plurality of the Tx coilassemblies 2100 of FIG. 22 are utilized for wirelessly transmittingelectrical power to one or more receiver devices. Relatedly, FIG. 23Billustrates a top down perspective view of the wireless power transfersystem 2300A. As illustrated, the system 2300 may include any “n” numberof Tx coil assemblies 2100A-N. Each of the Tx coil assemblies residewithin a mechanical housing 2400, which includes one or more structuralcomponents. As illustrated in the block diagram, the mechanical housing2400 includes a plurality of sub-zones 2410 of the mechanical housing2400. Each of the plurality of sub-zones 2410 is operatively associatedwith one member of the plurality of Tx coil assemblies 2100, up to anynumber “n” of sub-zones 2410. Each of the plurality of sub-zones 2410may be functionally associated with a charge envelope of its associatedTx coil assembly 2100. As defined herein, “charge envelope” refers toany distance from a Tx coil assembly 2100, any area proximate to a Txcoil assembly 2100, and/or any volume proximate to a Tx coil assembly2100, wherein a wireless power transfer receiver device, coil, antenna,and/or assembly is capable of coupling with the Tx coil assembly, 2100,for the purposes of a desired wireless power transfer. To that end, asub-zone 2410 being “functionally associated with a charge envelope of aTx coil assembly 2100” may refer to conditions wherein a receiver systemcan couple with the Tx coil, when in electrical operation, for thepurposes of wireless power transfer when the receiver system ispositioned proximate to the sub-zone 2410.

As illustrated, the wireless power transmission system 2300 includes aplurality of Tx coil assemblies 2100, wherein each Tx coil assembly 2100is individually capable of power transmission to one or more receivers.Alternatively, depending on the power requirements of the one or morereceivers, the one or more receivers may share one Tx coil assembly 2100of the plurality of Tx coil assemblies 2100 of the wireless powertransmission system 2300. Optionally, a transmitter coil of the Tx coilassemblies 2100 may be of a multiple coil construction comprising any ofthe multi-coil embodiments disclosed herein. The multiple coilconstruction of either the Tx coil assemblies 2100 may comprise two ormore coils connected in series.

Depending on the amplification requirements of an application, thewireless power transmission system 2300 may further comprise one or moresingle-stage amplifiers, one or more multi-stage amplifiers, and/orcombinations thereof. In some examples, such an amplifier may beincluded as part of the driving circuitry 2220 of the wireless powertransfer circuit 2200. The multi-coil construction of any of the Tx coilassemblies 2100, may be driven by one or more of the amplifiers of thesystem 2300 or the Tx coil assembly 2100, itself. Additionally, themultiple coil construction of a Tx coil assembly 2100 may be driven by asame amplifier stage either of the single-stage amplifier, or the sameone of the stages of the multi-stage amplifier. By having a Tx coilassembly 2100 having a multiple coil construction driven by a sameamplifier stage, one or more receivers can couple to one or more Tx coilassemblies 2100 for wireless power transfer without requiringindependent amplifiers for each transmitter coil.

In some examples, the multiple coil construction of any Tx coil assembly2100 may further include a capacitor placed along a series connection ofat least two coils of the multiple coil construction so that a voltage,a current, or both can revert to phase to maintain coil sensitivity lowand a stable system is preserved. This implementation may beadvantageous, in comparison to utilizing just a larger coil that wouldcover the same charge area as the 2 or more coils connected in series,because the multiple coil assembly may have higher coil-coil efficiency,lower inductance/better yield, and less coupling to foreign objects andbetter EMI due to the higher efficiency and less unshielded radiatingH-fields.

As illustrated, the wireless power transfer circuit board 2200 isoperatively associated with each of the Tx coil assemblies 2100. In theexemplary embodiment of FIG. 23A, the circuit 2200A may be or include acommon circuit having common electronics connected to each of the TxCoil assemblies 2100. Alternatively, as illustrated in the embodiment ofthe system 2300B, the circuit board 2200B may include a plurality ofsub-circuits 2210, wherein each of the plurality of sub-circuits 2210,up to any number “n” of sub-circuits 2210, are operatively associatedwith a respective one of the plurality of Tx coil assemblies 2100. Thetwo or more Tx coil assemblies 2100 may be configured as a single unit,or alternately may be configured as separate units residing within thesingle mechanical housing of the wireless transmission system 2300.

As illustrated in FIG. 23A, 23B, the wireless power transfer circuit2200A includes, at least, driving circuitry 2220. In some examples, thedriving circuitry 2220 is configured to drive each of the plurality ofTx coil assemblies 2100. Alternatively, in some examples such as thesystem 2300B of FIGS. 24A, 24B, the wireless power transfer circuitincludes a two or more driving circuits 2220A-N. In some such examples,at least two of the two or more driving circuits 2220 may besubstantially similar circuits, in design and/or function. In some otherexamples, at least two of the two or more driving circuits 2220 areconstructed on a common circuit board. In some alternative examples, atleast two of the two or more driving circuits 2220 are individuallyconstructed on two or more independent circuit boards.

The wireless power transfer circuit 2200 of the wireless powertransmission system 2300 comprises at least one controller 2210, forcontrolling operations of the system 2300, and driving circuitry 2220,for driving power transmission via one or more of the Tx coil assemblies2100. In some examples, the controller 2210 is configured to measurecurrent passing through a transmitter coil of one or more Tx coilassemblies 2100. In some examples, the controller 2210 may include or beembodied by one or more of a circuit board, circuitry, sensor(s), afirmware, or combinations thereof. The wireless power transfer circuit2200 may include and/or be one or more of a printed circuit board, amulti-layer printed wiring board, a point-to-point construction board,and any combinations thereof.

The circuit 2200 and/or any sub-circuits thereof supports at least oneTx coil assembly 2100 at a sub-zone 2410, each sub-zone 2410 of which isphysically and/or electrically connectable to a Tx coil assembly 2100.As illustrated in FIGS. 23-25 , the sub-zones 2410 are indicated by longdashed lines and, while each sub-zone 2410 is illustrated with a shape,it is contemplated that the subzones 2410 need not conform to theillustrated shapes and/or dimensions and each sub-zone 2410 may be anytwo or three dimensional space on or proximate to the housing 2400. Thecircuit 2200, in operation with the Tx coil assemblies 2100, allows thesystem 2300 to function as a multi device wireless power transmissionsystem 2300. It will be understood by those skilled in the art that anyembodiment of the Tx coil previously disclosed may be used to constructthe system 2300, wherein the Tx coil assemblies 2100 of the system 2300can either all be the same, all be different, or in any combinationbetween all being the same and all being different. Additionally, awireless power transmission system 2300 may comprise as many Tx coils,circuit boards, and/or circuits as required by the application and/orthat fits within the space allowed by the system 2300.

In some examples, the controller 2210 may include or be embodied by asingle controller 2210; alternatively, the controller 2210 may beembodied by a plurality of controllers 2210, functioning one or both ofindependently and in concert. In some examples, such as the exemplarywireless power transmission system 2300A of FIG. 23A, a singularcontroller 2210 may be configured to control operations of the Tx coilassemblies 2100 and/or the driving circuitry 2220; thus the controller2210 may be configured as a common controller of the Tx coil assemblies2100.

In some examples, such as certain examples related to the exemplarysystem 2300A of FIGS. 23A, 23B, the controller 2210 may comprise atleast one controller being partitioned so that one or more transmissionoperations can be executed when one or more wireless power receiversrequire substantially different parameters for wireless power reception.In a non-limiting example, the controller 2210 may comprise a partitioncomprising a selection circuitry configured to query a wireless powerreceiver and then identify and select which of the two or more Tx coilassemblies 2100, residing in the single mechanical housing 2400, isrequired to efficiently execute wireless power transmission to thewireless power receiver(s). In another non-limiting example, thecontroller 2210 may also comprise a partition capable of assessing thedistance between a wireless power receiver and the wireless transmissionsystem 2300 to identify, based on the distance determined, how muchpower to transmit to the wireless power receiver, and then identify andselect which of the two or more Tx coil assemblies 2100, residing in thesingle mechanical housing 2400, is required and is or is not availablefor transmission. If the appropriate Tx coil assembly 2100 is notavailable, the partitioned controller 2210 may further be configured toplace the waiting wireless power receiver in the queue for coupling tothe required wireless power transmitter upon completion anddisengagement of the required Tx coil assembly 2100 from the previouslycoupled wireless power receiver.

In another example system 2300A wherein a single controller 2210 is inuse the controller 2210 is optionally connected to multiple Tx coilassemblies 2100, wherein the single controller 2210 scans across theoptionally connected Tx coil assemblies 2100 to detect whether one ormore receivers are present, then provides one of selecting, matching,pairing, or combinations thereof the one more Tx coil assemblies 2100and the one or more receivers for wireless power transfer.

Turning now to FIG. 25A, the single mechanical housing 2400 isillustrated in a transparent, three-dimensional illustration. Structuralfeatures of the housing 2400 are indicated with dotted lines and theillustration is intended to show an exemplary housing 2400 and itsrelation to other elements of the system 2300. In some examples, thehousing 2400 may define one or more mechanical alignment features 2420for aligning either transmitters and receivers, Tx and Rx coils, Tx andRx modules, Tx and Rx assemblies, or Tx and Rx devices or apparatuses.As illustrated, the mechanical alignment features 2420 may be configuredfor aligning a receiver (Rx) coil assembly 2510, of at least onewireless receiver system 2500, with one of the Tx coil assemblies,proximate to a sub-zone 2410A. As illustrated in FIGS. 25A-C, thehousing 2400 may define any number “n” of mechanical alignment features2420, each for aligning an Rx coil assembly 2510 with a Tx coil assembly2100, for wireless power transfer via the system 2300.

One or more of the mechanical alignment features 2420 may include or bedefined by the housing 2400 as a non-flat surface of the housing 2400.In some such examples, such as the illustration shown in FIG. 25B, themechanical alignment features 2420 may optionally be configured toprovide one or more docking structures capable of docking and/orotherwise containing one or more wireless receiver systems 2500, whereinat least one of the mechanical alignment features 2420 providesalignment between a Tx coil assembly 2100 and an Rx coil assembly 2510.The mechanical alignment features 2420 may either all be the same, allbe different, or in any combination between all being the same and allbeing different, so that one or more differently configured, sized, oroperational receivers can be concurrently accommodated for simultaneouspower transmission. It is contemplated that such embodiments,independently or in various combinations thereof, enables wireless powertransfer to various receiver configurations, power requirements and/orsizes at the same time.

In addition to the mechanical alignment features 2420, at least onemechanical alignment feature 2420 of the system 2300 may furtheroptionally be configured to be attachable and/or detachable from a portof the system 2300 so that a receiver comprising a difference in one of:size, shape, profile, contour, form, outline, identity, model, power,frequency, operation, or combinations thereof, may be concurrentlyaccommodated for simultaneous power transmission by simply attaching tothe housing 2400, and then detaching from the housing 2400 whentransmission is completed. It is understood that various individualmechanical alignment features 2420 and/or portions of the housing 2400of different configurations and sizes may be available for attachmentand detachment from the single mechanical housing 2400 of the system2300. The mechanical housing 2400 may also be optionally configured withat least one additional connection port 2470 that permits attachmentand/or detachment of a support apparatus such as a USB device, aportable hard drive, an external circuit board, an external firmware, anexternal software, a key fob, a docking structure, a charging pad, anRFID reader, or combinations thereof. Thus, the system 2300 offersconnection port 2470 having the capability of wireless power transfer tovarious other additional receivers regardless of receiver configuration,power requirements or size, using the bay that is configured forattachment/detachment of the docking structure, while the other bays ofthe multi-bay power transfer system is charging other devises in theircorresponding docking structures. Likewise, the at least one additionalconnection port 2470 provides the system 2300 with the capability ofadding peripheral functionality when required, such as when anapplication may require functional use of external structures or deviceswhile wirelessly transferring power to docked receiving devices.

In some examples, such as the system 2300C of FIG. 25C, the housing 2400may include a plurality of connectable structures 2430, thus allowingfor modularity in the wireless power transmission system 2300C. To thatend, in the exemplary embodiment of FIG. 25C, the housing 2400 includesa first structure 2430A, which may be a base structure for the housing2400, and a second structure 2430B, which may be an expansion structurefor adding additional Tx coil assembly(ies) 2100N to the system 2300. Tothat end, the second structure 2430B may be configured to house at leastone Tx coil assembly 2100. In some examples, the second structure 2430Bmay house one or more sub-circuits 2205 of the wireless power transfercircuit 2200; alternatively, in some examples, the second structure2430B may include no circuitry and be driven and/or controlled by thewireless power transfer circuit 2200 which, in this example, is housedand/or operatively associated with the first structure 2430A.

The system 2300C further includes a removable connection 2600, forconnecting/disconnecting any structure(s) 2430 of the housing 2400. Inthe non-limiting example of the removable connection 2600, asillustrated in 25C and the magnified view in FIG. 26 , the removableconnection 2600 includes elements associated with multiple structures2430 of the housing 2400. For example, the removable connection 2600 mayinclude one or more protruding features 2610 on or operativelyassociated with the second structure 2430B, each of the protrudingfeatures 2610 operatively associated with an electrical contact 2620operatively associated with, at least, a Tx coil assembly 2100 housed bythe second structure 2430. In such examples, the removable connection2600 may include recessing features 2630, the recessing features 2630substantially corresponding, at least in part, with a shape of theprotruding features 2630. Each of the recessing features 2630 may beoperatively associated with a circuit electrical contact 2640, which maybe configured to attach additional electronics to the wireless powertransfer circuit 2200. Accordingly, when in connection, the protrudingfeatures 2610 and recessing features 2630 act to connect the electricalcontacts 2620 with the circuit electrical contacts 2640 to allow for oneor both of communicative connection and power transfer connection. Tothat end, the protruding features 2610 and the recessing features 2630may have a male/female connective relationship, wherein the protrudingfeatures 2610 are “male” connective components and the recessingfeatures 2630 are “female” connective components.

By utilizing a system 2300C with a modular construction, wherein one ormore structures, constructs, assemblies, components, configurations,apparatuses, or combinations thereof may be combined to: increase thenumber, size, shape or combinations thereof of a charging surface;extend, adapt, modify, alter, increase, decrease, focus, defocus orcombinations thereof of a magnetic field; provide and/or augment thermalmanagement, provide and/or augment magnetic field management, provideand/or augment magnetic field concentration, provide and/or augmentelectromagnetic interference (EMI) mitigation, provide and/or augmentnoise susceptibility shielding, provide and/or augment magnetic fieldcoupling strength (capture) for broader and/or stronger wireless powertransmission, provide and/or augment wireless power transmission atextended distances, or combinations thereof. The modular construction ofthe multi-bay power system may further comprise at least onedual-function area, wherein the dual-function area is configured to docka receiver and to receive wireless power transfer from the one or moretransmitters of the multi-bay power system, meaning that the bay itselfnot only docks a receiver, but is also a receiver itself. Such adual-function bay may be charged separately, or alternatively at thesame time as a docked device to this bay, so that the chargeddual-function bay may, in turn, charge another receiver at a timedifferent from when the dual-function bay is charged.

The use of a single input power source for multiple transmitter systemsand their associated receiver systems can lead to degraded performancewhen one receiver system is removed from its transmitter system. Forexample, in dual charger systems, cross talk and/or cross coupling mayoccur.

Cross coupling may occur when one transmitter remains in power transfermode when there is no receiver associated with that transmitter whilethere is still a receiver associated with the other transmitter. Thesystem may work properly when there is only one receiver system charginginitially or when both receiver systems are charging at the same time.However, cross coupling can occur when there are two receiver systemscharging and then one receiver system is removed from its transmittersystem. In this case, the transmitter system that is to be idled mayremain in power transfer mode if it detects that it is receivingpackets. “Packets,” as referenced herein, refer to any power and/or datasignal(s) transferred from a transmission system 2220 to a receiversystem 2500. That is, due to the proximity of the two transmittersystems to one another, the now-unused transmitter system may mistakenlyaccept packets sent from the other receiver system intended for theother transmitter system.

This cross talk can cause a number of problems in the system. First, theuser experience may be degraded because the charging light or othercharging indicator on the unused transmitter system (e.g., a pair of asubcircuit 2205 and Tx coil assembly 2100) may remain lit even thoughthere is no associated receiver system present. Secondly, as the unusedtransmitter remains in power transfer mode without an associatedreceiver system, overall charging efficiency decreases and systemthermal issues may arise.

The primary cause of the observed cross talk is feedback into the inputpower system that powers both transmitter systems. This can be betterunderstood by reference to FIG. 27 , which shows the system architectureof FIGS. 24 , but with the with the second receiver system now removedand with certain relevant driving circuitry shown for clarity.

As will be recalled, the first transfer circuit 2205A and secondtransfer circuit 2205B share a single front end and input voltage source2212. Shown in greater detail in this figure are the H-bridge circuits2222A, 2222B used to power respective antennas 2100A, 2100B. EachH-bridge circuit 2222A, 2222B is powered, by the common source 2212, ata voltage Vbridge. Any noise appearing on Vin will often appear on theVBridge signals that drive the antennas 2100A, 2100B. As a result, thisnoise can then appear on the coil (antenna) voltage as well, as if itwere a signal from a receiver antenna.

In the illustrated configuration, this has the effect of creating a“ghost” signal on antenna 2100A, even though the respective receiversystem 2500 is no longer present. This ghost signal appearing in thecoil voltage may be processed as follows to yield received packets thatwere actually sent by receiver system 2500B for transfer circuit 2205B.In systems such as Qi and Qi like systems, a receiver sends data andpackets to its associated transmitter using ASK (Amplitude shiftkeying). Those packets are demodulated on the transmitter side usingvoltage demodulation. As shown, the sensed coil voltage is demodulatedby rectification (via rectifier 251) and filtering (via filter 253). Thedemodulated signal VDEM is then input to an ASK Decoder 255 for thedecoding of packets.

Supply voltage disturbances that are reflected in the coil voltage viaVBridge thus have the potential to persist through rectification andfiltering, to be recognized as packets rather than noise, hence theghost packets. This is especially true when the supply voltagedisturbances are the result of crosstalk with a coil (antenna 2100B)that is actually receiving packets (from antenna 2510B) that arespecifically designed to survive and indeed be emphasized bydemodulation.

In short, depending upon magnitude, noise in the voltage supply canaffect the demodulation of the packets at the ostensibly idledtransmitter. In the illustrated environment of FIG. 27 , this means thatwhen two receivers are charging, and one is then removed, the noise/loadon the voltage line remains unchanged. This can result in the noise/loadbeing perceived by the idled transmitter as received packets and not asnoise. This state may persist despite the fact that there is no longer areceiver present on or associated with the affected transmitter.

In an embodiment, in order to alleviate data feedback between antennasthrough the power supply to coil drivers, one of the transmitter systempower inputs is selectively isolated via a low voltage drop out (LDO).This feature is shown in simplified schematic form in FIG. 29 . Asshown, the LDO 62 isolates the power supply for the first transmittersystem 2205A from the power supply for the second transmitter system2205B while still allowing the use of a single power source 2212.

In an embodiment, the LDO output voltage (Voutldo) is set to 4.6V inorder to ensure it does not bypass LDO; that is, with Voutldo set to4.6V, the level of Vinldo (Vin) will always be higher than Voutldo. Thisvalue is based on the observation that Vin will drop to about 4.7V infull load condition when two devices will be charging simultaneously. Itwill be appreciated that the LDO Voutldo may be set to any otherappropriate value that meets the foregoing requirement of remaininglower than Vinldo (Vin) under load.

In an embodiment, another LDO is placed at the power input of theremaining transmitter to nullify the return path of noise from the firsttransmitter through the common ground. However, in yet anotherembodiment, only a single LDO is used, and software filtering isemployed to reduce noise on the demodulated signal. This approachprovides a low cost solution to alleviate cross talk while stillallowing the use of a single common voltage adapter for the dual chargersystem.

The system 2300 may comprise and/or include one or more circuit boards.The one or more circuit boards may comprise one of a printed circuitboard (PCB), a multi-layer printed wiring board, a point-to-pointconstruction board, or combinations thereof. The circuit board maycomprise any number of circuits and/or any number of variations of acircuitry arrangement, including various additions to the circuit boardcircuit or circuits and/or circuitry, including but not limited to,components, wires, wiring, adaptors, connectors, extensions, ports, orcombinations thereof, so that wireless transmission efficiency isincreased and/or transmission distances are extended in accordance withthe requirements of an application. The one or more circuit boards mayindividually be electrically connected uniquely to each of either two ormore wireless power transmitters, two or more wireless power receivers,two or more bays, two or more docking structures, one or morecontrollers, one or more firmware, or combinations thereof.Alternatively, a single circuit board may be electrically connected toone of two or more wireless power transmitters, two or more wirelesspower receivers, two or more bays, two or more docking structures, oneor more controllers, one or more firmware, or combinations thereof. Acircuit board may also be separately electrically connected uniquely toone or more transmitter, one or more receiver, one or more Tx coil, oneor more Rx coil, one or more Tx module, one or more Rx module, one ormore Tx assembly, one ore more Rx assembly, one or more Tx device, oneor more Rx device, one or more Tx apparatus, one or more Rx apparatus,or combinations thereof.

The circuitry of the wireless power transmission system 2300 maycomprise conditioning circuitry. The conditioning circuitry may comprisea resistor network. The conditioning circuitry may specify a thresholdfor activation. The threshold activation may comprise a protectionand/or an operation threshold, wherein the activation thresholdspecified comprises one of an over voltage protection (OVP), an undervoltage protection (UVP), an over current protection (OCP), an overpower protection (OPP), an over load protection (OLP), an overtemperature protection (OTP), a no-load operation (NLO) a power goodsignal, or combinations thereof. The conditioning circuitry may compriseone or more positive temperature coefficient (PTC) fuses. One or more ofthe PTC fuses may be resettable. The conditioning circuitry may compriseone or more field-effect transistors (FETs). One or more FETs maycomprise a P-channel or P-type metal oxide semiconductor FET(PMOSFET/PFET) and/or an N-channel or N-type metal oxide semiconductorFET (NMOSFET/NFET). The conditioning circuitry may comprise one of anFET, an NFET, a PFET, a PTC fuse, or combinations thereof. Theconditioning circuitry may further comprise one of an FET, an NFET, aPFET, a PTC fuse, or combinations thereof within one or more integratedcircuits, one or more circuit boards, or combinations thereof. Theconditioning circuitry may comprise components having current ratings of4 A-10 A. The conditioning circuitry may comprise a Q factor sensingcircuit having a resistor comprising a power rating of 0.5 W. Theconditioning circuitry may comprise coil tuning capacitors having avoltage rating of 100 V-400 V. Such a voltage rating mitigates damageof, for example, coil tuning capacitors while operating at powertransfers up to 30 W. The conditioning circuitry may comprise inductorshaving power conversion current saturation ratings of 7 A-20 A. Suchratings prevent damage to wireless power system circuitry whileoperating at power transfers up to 30 W and/or when subjected to largein-rush currents.

The wireless power transmission system 2300 and/or the controller 2210thereof may comprise firmware, the firmware comprising an instruction,the instruction comprising one of a tuning instruction, a detectioninstruction, an authentication instruction, a settings instruction, averification instruction, an interrogation instruction or combinationsthereof. The firmware may further comprise an instruction to dynamicallyallocate frequency range to the one or more transmitters residing withinthe single mechanical housing of the multi-bay power system in order tomitigate any of noise or interference sources disclosed previously. Thefirmware instruction may further comprise one of tuning, adjusting,foreign object detection (FOD), authentication, authenticationmediation, verifications, power requirements, or combinations thereof.The instruction may provide functional instruction to a component, anassembly, a module, a structure, a construct or a configuration. Forexample, a firmware may adjust coil gain, mediate authentication betweena transmitter and a receiver prior to starting wireless power transfer,and/or differentiate between a foreign object and an acceptable objectby interrogating the electronics or firmware of each before initiatingthe function. In some embodiments, a firmware works in concert withelectronics to interrogate and/or verify an object is foreign oracceptable before and/or after power transfer.

The wireless power transmission system 2300 and/or the controller 2210thereof may comprise controller firmware configured to limit an amountof current passing through a transmitter coil. The current limit mayfurther be statically set by a system designer. The current being passedthrough the transmitter coil can be varied by methods that include butare not limited to: frequency modulation, amplitude modulation, dutycycle modulation, phase modulation, or combinations thereof. Thecontroller firmware may limit an amount of current passing through atransmitter coil based on a static threshold that is programmed into acontroller. The controller firmware may limit an amount of currentpassing through a transmitter coil, wherein the limit can be dynamicallycalculated based on a data set of parameters that is eitherpre-programmed or measured directly on a transmitter device.

The wireless power transmission system 2300 may comprise one or moreantennas, wherein any one of the antenna configurations previouslydisclosed herein may be, uniquely or in various combinations,physically, thermally and/or electrically connected to any component,structure, assembly, module, or combinations thereof of the multi-baypower system. The one or more antennas may further comprise one or moreconductors, wherein the one or more conductors comprise one of a singleelement or a multitude of elements, and wherein the single element orthe multitude of elements may further comprise one of a wire also aspreviously disclosed herein, that is, comprising one of a trace, afilar, a filament or combinations thereof. The multitude of elements mayfurther comprise wires, traces, filars, and filaments that may be woven,twisted or coiled together, which may include a Litz wire, a ribbon, ora cable. The wire as previously defined may further comprise a baremetallic surface or alternatively, may comprise a layer of electricallyinsulating material, such as a dielectric material that contacts andsurrounds the metallic surface of the wire. Additionally, the one ormore antennas of the multi-bay power system may further comprise variousother features, structures, or constructions that may provide one of:limiting electromagnetic interference (EMI) levels; managing excessheat; ruggedizing to withstand shock, vibration, impacts and drops,detecting foreign objects; communicating data effectively; maximizingefficiency of, between and across multiple wireless power transmitters;and combinations thereof; wherein functionality provided by each featureembodied within the one or more antennas may either be providedindividually or simultaneously one with another. It is contemplated thatn number of features may be provided simultaneously in any one or moreof the one or more antennas.

In addition to the antenna configurations disclosed herein, the wirelesspower transmission system 2300 may also comprise antennas comprising:the multi-layer multi turn technology described in the previouslypresented U.S. Patents incorporated herein by reference; the multi modeantennas of U.S. Pat. Nos. 9,941,590, 9,941,729, 9,941,743, 9,948,129,9,960,628, 9,960,629, 10,063,100, and U.S. Pat. Pub. No. 2019/0097461,the contents of which are fully incorporated herein by reference; andthe antennas having coil construction as disclosed in U.S. Pat. Pub.Nos. 2018/0343038, 2018/0343039, 2018/0343040, 218/0343041, and2018/0343042, the contents of which are also fully incorporated hereinby reference. The multi-bay power system may also comprise printedcircuit board (PCB) antennas, printed coil technology antennas, solidwire antennas, stamped coil antennas, laser cut coil antennas, litz wireantennas, chip antennas, trace antennas, FR4 antennas, flexible printedcircuit board (FPC) antennas, ceramic substrate antennas, dipoleantenas, loop antennas, and combinations thereof. Moreover, themulti-bay power system may also comprise any commercially availableantenna that may provide added value to the purpose and functionality ofthe intended application.

A wireless power system for transferring power at extended coil-to-coildistances, extended transmitter-receiver ranges, and/or largertransmitter-receiver volumes comprises a receiving coil; one or morereceiving electronics electrically connected to the receiving coil; atransmitting coil comprising a magnetic material; the transmitting coilbeing capable of being coupled to the receiving coil and, one or moretransmitting electronics. A wireless power system for transferring powerat extended coil-to-coil distances, extended transmitter-receiverranges, and/or larger transmitter-receiver volumes comprises a receivingcoil; one or more receiving electronics electrically connected to thereceiving coil; a transmitting coil comprising a magnetic material; thetransmitting coil being capable of being coupled to the receiving coiland, one or more transmitting electronics. The wireless power system ofthe present application further comprises one or more transmittingelectronics electrically connected to the transmitting coil, wherein thetransmitting electronics comprises a control system loop, wherein whenthe control system loop varies, one or more of a frequency, an inputvoltage, an input current, or a duty cycle, or phase, the wireless powersystem maintains uninterrupted operation. The wireless power system ofthe present application also further comprises at least one receivingelectronics, wherein the at least one receiving electronics comprises arectified voltage range between 8V and 50V. The wireless power system ofthe present application may comprise an operating frequency, wherein theoperating frequency ranges from about 25 kHz to about 300 kHz. Thewireless power system of the present application may transfer power thatis greater than 1 nW up to 30 W. The wireless power system of thepresent application may transfer power at a coil-to-coil distanceranging from 5 mm to 25 mm. The wireless power system of the presentapplication comprises a transmitting coil, wherein the transmitting coilcomprises a transmitting coil surface and the magnetic materialcomprises a magnetic material surface, wherein the magnetic materialsurface is equal to or greater than the transmitting coil surface. Thewireless power system of the present application further comprises amagnetic material surface, wherein the magnetic material surfacecomprises a surface area between 700 mm² and 10,000 mm². The wirelesspower system of the present application further comprises a magneticmaterial surface, wherein the magnetic material surface furthercomprises two or more horizontal planes, wherein at least one of the twoor more horizontal planes extends beyond another horizontal plane. Thewireless power system of the present application comprises one or moretransmitting electronics, wherein the one or more transmittingelectronics further comprises a tuning circuit. The wireless powersystem of the present application comprises a tuning circuit, wherein,when the tuning circuit is adjusted, the resonant frequency of an LCtank of the tuning circuit resonates at a frequency lower than anoperating frequency of the wireless power system. The wireless powersystem of the present application comprises a magnetic material, whereinthe magnetic material comprises one of a T-core shape, an E-core shape,a custom shape, or combinations thereof. The wireless power system ofthe present application comprises a coil assembly, wherein the coilassembly comprises a coil and a magnetic material, wherein the magneticmaterial resides at an inner diameter of the coil of the coil assembly,and wherein the coil and the magnetic material comprise a gap of atleast 2 mm located therebetween. The magnetic material may be a magneticmaterial. The magnetic material may comprise a magnetic body. Themagnetic body may further comprise a single, unitary constituent, thesingle unitary constituent further comprising one or more structuralcomponents. The wireless power system of the present application maycomprise at least one a transmitting coil and at least one receivingcoil, wherein either the at least one transmitting coil, the at leastone receiving coil, or both comprise one of a single coil, a multi-layercoil, a multi-tiered coil, or combinations thereof. The multi-layercoil, the multi-tiered coil, or both may further comprise a coilstructure comprising one or more coils. The multi-layer coil, themulti-tiered coil, or both may further comprise at least one seriesconnection. The multi-layer coil, the multi-tiered coil, or both mayreside in one or more horizontal planes.

As used herein, a “power system” is generally used interchangeably witha power transmitting system, a power receiving system, and/or apower-generating system. Non-limiting examples include: wireless powertransmitters or wireless power receivers; transmitters or receivers; Txor Rx. The term “power system” as used herein is defined as a device oran apparatus that sends, accepts, broadcasts, communicates, or carries asignal, power, energy and/or data from one point, location, apparatus orapparatuses to another point, location, apparatus or apparatuses, orover a part or all of a line or path without the use of wires as aphysical link.

The term “electrically connected” or “electrically connectable” isherein defined as an electrical connection between two or moreelectrically conductive structures. The electrical connection may be adirect physical and/or mechanical electrical connection, comprising athird or more structures or components such as a via, a solder, a tab, awire, a pin, a screw, a rivet, or combinations thereof; or may be adirect mechanical electrical connection comprising one or moreelectrically conductive structures directly attached one to the other;or may, alternatively, be a conductively coupled electrical connection,wherein electrical energy transfers between two independent electricallyconductive structures that are in direct physical contact.

The term “thermally connected” or “thermally connectable” is hereindefined as a thermal connection between two or more thermally conductivestructures. The thermal connection may be a direct physical and/ormechanical thermal connection, comprising a third or more structures orcomponents such as an adhesive, a gasket, a pad, a plate, a block, abody, a sheet, a film, a foil, a fabric, a screen, a weave, a mesh, afoam, a custom fiber or wire form, a braid, a composite of a highthermal conductivity material, or combinations thereof; or may be adirect mechanical thermal connection comprising one or thermallyconductive structures directly attached one to the other; or may,alternatively, be a conductively coupled thermal connection, whereinthermal energy transfers between two independent thermally conductivestructures that are in direct physical contact.

The term “couples”, “coupled”, or “coupling” as used throughout thisspecification generally refers to magnetic field coupling, and excludesthe above specifically defined terms “conductively coupled electricalconnection” and “conductively coupled thermal connection”. Magneticfield coupling occurs when the energy of a transmitter and a receiver iscoupled to each other through a magnetic field.

The word “constituent” is used herein to mean “the individual componentsthat make an assembly.” The word “component” is used herein to mean “oneof a collection of independent constituents of an assembly.” Anembodiment therefore is constituted of individual constituentcomponents.

The word “exemplary” is used herein to mean “serving as an example,instance, or illustration.” Any embodiment described herein as“exemplary” or as an “example” is not necessarily to be construed aspreferred or advantageous over other embodiments. Furthermore, to theextent that the term “include,” “have,” or the like is used in thedescription or the claims, such term is intended to be inclusive in amanner similar to the term “comprise” as “comprise” is interpreted whenemployed as a transitional word in a claim. Furthermore, to the extentthat the term “include,” “have,” or the like is used in the descriptionor the claims, such term is intended to be inclusive in a manner similarto the term “comprise” as “comprise” is interpreted when employed as atransitional word in a claim.

As used herein, the phrase “at least one of” preceding a series ofitems, with the term “and” or “or” to separate any of the items,modifies the list as a whole, rather than each member of the list (i.e.,each item). The phrase “at least one of” does not require selection ofat least one of each item listed; rather, the phrase allows a meaningthat includes at least one of any one of the items, and/or at least oneof any combination of the items, and/or at least one of each of theitems. By way of example, the phrases “at least one of A, B, and C” or“at least one of A, B, or C” each refer to only A, only B, or only C;any combination of A, B, and C; and/or at least one of each of A, B, andC.

The predicate words “configured to”, “operable to”, and “programmed to”do not imply any particular tangible or intangible modification of asubject, but, rather, are intended to be used interchangeably. In one ormore embodiments, a processor configured to monitor and control anoperation or a component may also mean the processor being programmed tomonitor and control the operation or the processor being operable tomonitor and control the operation. Likewise, a processor configured toexecute code can be construed as a processor programmed to execute codeor operable to execute code.

A phrase such as “an aspect” does not imply that such aspect isessential to the subject technology or that such aspect applies to allconfigurations of the subject technology. A disclosure relating to anaspect may apply to all configurations, or one or more configurations.An aspect may provide one or more examples of the disclosure. A phrasesuch as an “aspect” may refer to one or more aspects and vice versa. Aphrase such as an “embodiment” does not imply that such embodiment isessential to the subject technology or that such embodiment applies toall configurations of the subject technology. A disclosure relating toan embodiment may apply to all embodiments, or one or more embodiments.An embodiment may provide one or more examples of the disclosure. Aphrase such an “embodiment” may refer to one or more embodiments andvice versa. A phrase such as a “configuration” does not imply that suchconfiguration is essential to the subject technology or that suchconfiguration applies to all configurations of the subject technology. Adisclosure relating to a configuration may apply to all configurations,or one or more configurations. A configuration may provide one or moreexamples of the disclosure. A phrase such as a “configuration” may referto one or more configurations and vice versa.

In this disclosure, the term “battery” is understood to refer to one ofseveral types of loads; for instance, it can refer to an energy storagecomponent, a series of energy storage components, or some other type ofload which is adapted to receive electrical power. It will beappreciated that embodiments disclosed herein are adaptable to providepower and/or current to elements other than a battery; non-limitingexamples include capacitors and general electrical devices and/orapparatuses.

Throughout this specification, the terms “T-core”, “T-shape”, and“top-hat” may be used interchangeably. As defined herein, and areunderstood to refer to a particular structure, wherein a magneticmaterial, such as a magnetic, comprises a larger structure and a smallerstructure, the larger structure extending beyond the smaller structure.In some embodiments, the larger structure may comprise at least onehorizontal plane. In some embodiments, the larger structure may providea base for the smaller structure. The smaller structure may reside atop,below, or both atop and below the larger structure. The smallerstructure may be positioned centrally, off-center, askew, angled,obliquely, symmetrically, asymmetrically, out of line, to one side, onone side, unevenly, or axially aligned relative to the larger structure.In an embodiment the magnetic material comprises a smaller structurepositioned atop (or below, depending on orientation) a larger structure.The smaller structure of said arrangement may comprise the same magneticmaterial as that of the larger structure; or, alternatively, the smallerstructure of said arrangement may comprise a different magnetic materialthan that of the larger structure. It is anticipated that the magneticmaterial of either the smaller structure, the larger structure, or bothmay comprise multiple magnetic materials that either differ incomposition or are of the same composition, are layered in-line witheach other or are staggered one from another, are of identical sizeand/or shape or differ in size and/or shape, any of which alone or incombination may be applied depending on the requirement(s) of theapplication, and/or the specific desired performance outcome(s)intended. For example, two or more magnetic materials may be layered,meshed, woven, braided, rolled, or extruded so that the two or morematerials are distributed throughout the smaller structure, the largerstructure or both. The magnetic materials may even be pressed orextruded forming either the smaller structure, the larger structure, orboth, wherein the structure(s) thereof comprises two or more discretemagnetic material regions.

Said “T-core”, “T-shape”, or “top-hat” arrangement may alternatelycomprise one single unitary body, wherein a magnetic material of thesingle unitary body comprises a smaller structure physically protrudingfrom a larger structure. The unitary body may comprise more than onemagnetic material. For example, two or more magnetic material pieces (ofthe same size, or of differing size) may be layered and then formed tocreate a unitary body having the “T-core”, “T-shape”, or “top-hat”protrusion. Alternatively, a composite magnetic material piececomprising two or more magnetic materials, wherein the magnetic materialmay be meshed, woven, braided, rolled, or extruded so that the two ormore materials are distributed through the unitary body. The magneticmaterials may even be pressed or extruded forming a unitary bodycomprising two or more discrete magnetic materials regions within theunitary body. In this case, for example, one magnetic material regionmay provide for the smaller structure portion of the unitary body, whilea different magnetic material region may provide the larger structureportion of the unitary body.

In addition to the above, it is also anticipated that this type of shapecan be adapted to allow a coil of wire, a multi-layer printed coil, amulti-layer multi-turn printed coil, or other electrically conductivematerial, to sit atop the larger component while surrounding the smallercomponent. This setup combines benefits of a magnetic material core,such as a magnetic core, with benefits of a magnetic material base, suchas a magnetic base. As defined herein, the word “wire” is a length ofelectrically conductive material that may either be of a two dimensionalconductive line or track that may extend along a surface oralternatively, a wire may be of a three dimensional conductive line ortrack that is contactable to a surface. A wire may comprise a trace, afilar, a filament or combinations thereof. These elements may be asingle element or a multitude of elements such as a multifilar elementor a multifilament element. Further, the multitude of wires, traces,filars, and filaments may be woven, twisted or coiled together such asin a cable form. The wire as defined herein may comprise a bare metallicsurface or alternatively, may comprise a layer of electricallyinsulating material, such as a dielectric material that contacts andsurrounds the metallic surface of the wire. A “trace” is an electricallyconductive line or track that may extend along a surface of a substrate.The trace may be of a two dimensional line that may extend along asurface or alternatively, the trace may be of a three dimensionalconductive line that is contactable to a surface. A “filar” is anelectrically conductive line or track that extends along a surface of asubstrate. A filar may be of a two dimensional line that may extendalong a surface or alternatively, the filar may be a three dimensionalconductive line that is contactable to a surface. A “filament” is anelectrically conductive thread or threadlike structure that iscontactable to a surface. In summary, a magnetic material T-shape may becreated from multiple pieces of magnetic material, or from a singlemagnetic material piece, either homogenous, heterogeneous, composite, orcombinations thereof.

In this disclosure, terms such as “E-core”, or “E-shape” are understoodto refer to a setup comprising a magnetic base, a magnetic core atop themagnetic base, and a magnetic ring extending upward from the magneticbase. A cross-section of this setup generally forms the shape of aletter “E”. The shape of the letter “E” may have several rotationalorientations. A magnetic E-shape might be formed from multiple materialpieces of magnetic, or from a single material body.

Note that combinations and shapes of magnetic are contemplated otherthan the above shapes; some of these might include combining elementssuch as a base, a core, and/or a ring in ways that form shapes differentfrom those specified above.

The different type of core shapes mentioned may not only improveperformance but focus the fields to the center receiver coil positionsuch that transmitter coils may be placed closer to each other withoutcausing coupling interference, cross connects, or false connects. Thedifferent type of core shapes also help mitigate EMI by focusing thefield directly to where the receiver will be placed, reducing theunshielded radiating H-fields.

Additionally, the above definitions shall be understood to includematerials which provide functional benefits similar to magnetic, such ascertain ceramic materials.

All structural and functional equivalents to the elements of the variousaspects described throughout this disclosure that are known or latercome to be known to those of ordinary skill in the art are expresslyincorporated herein by reference and are intended to be encompassed bythe claims. Moreover, nothing disclosed herein is intended to bededicated to the public regardless of whether such disclosure isexplicitly recited in the claims. No claim element is to be construedunder the provisions of 35 U.S.C. § 112, sixth paragraph, unless theelement is expressly recited using the phrase “means for” or, in thecase of a method claim, the element is recited using the phrase “stepfor.”

Reference to an element in the singular is not intended to mean “one andonly one” unless specifically so stated, but rather “one or more.”Unless specifically stated otherwise, the term “some” refers to one ormore. Pronouns in the masculine (e.g., his) include the feminine andneuter gender (e.g., her and its) and vice versa. Headings andsubheadings, if any, are used for convenience only and do not limit thesubject disclosure.

While this specification contains many specifics, these should not beconstrued as limitations on the scope of what may be claimed, but ratheras descriptions of particular implementations of the subject matter.Certain features that are described in this specification in the contextof separate embodiments can also be implemented in combination in asingle embodiment. Conversely, various features that are described inthe context of a single embodiment can also be implemented in multipleembodiments separately or in any suitable sub combination. Moreover,although features may be described above as acting in certaincombinations and even initially claimed as such, one or more featuresfrom a claimed combination can in some cases be excised from thecombination, and the claimed combination may be directed to a subcombination or variation of a sub combination.

What is claimed is:
 1. A wireless power transfer system comprising: aninput power supply providing power at a first voltage V₁; a firstwireless power transmission system receiving power at a first powerinput from the input power supply, the first wireless power transmissionsystem including a first transmitter antenna and a first transfercircuit for driving the first transmitter antenna for wireless powertransmission to a first wireless receiver system and wireless receipt ofdata from the first receiver system, wherein data wirelessly received atthe first transmitter antenna from the first receiver system at leastpartially feeds back onto the first power input; and a second wirelesspower transmission system including a second transmitter antenna and asecond transfer circuit for driving the second transmitter antenna forwireless power transmission to a second wireless receiver system, and alow voltage drop out receiving power from the input power supply at V₁and providing power at a preselected lower voltage V₂ to the secondwireless power transmission system at a second power input, such that V₂is independent of data received at the first transmitter antenna that isat least partially fed back onto the first power input.
 2. The wirelesspower transfer system of claim 1, wherein the first and second transfercircuits each comprise an H-Bridge.
 3. The wireless power transfersystem of claim 2, wherein the data wirelessly received at the firsttransmitter antenna that at least partially feeds back onto the firstpower input is fed back by a power input of the H-Bridge.
 4. Thewireless power transfer system of claim 1, wherein V₁ varies over arange having a lowest value, and wherein the preselected voltage V₂ isset to remain below the lowest value of the range of V₁.
 5. The wirelesspower transfer system of claim 1, wherein one or both of the first andsecond receiver systems includes a powered load.
 6. The wireless powertransfer system of claim 5, wherein the load is an electrical energystorage device.
 7. The wireless power transfer system of claim 1,wherein the first and second wireless power transmission systems furtherinclude respective transmission controllers configured to providerespective antenna signals to the respective transfer circuits.
 8. Thewireless power transfer system of claim 1, wherein the communicationssignals are coded via amplitude shift keying (ASK).
 9. The wirelesstransmission system of claim 1, wherein each of the first transmissionantenna and the second transmission antenna are configured to operatebased on an operating frequency of about 88-360 kHz.
 10. A wirelesspower transfer system comprising: an input power supply providing powerat a first voltage V₁; a first wireless receiver system and a secondwireless receiver system, each being configured to wirelessly receivepower from a respective wireless power transmission system via awireless power protocol and to wirelessly transmit data to therespective wireless power transmission system via the wireless powerprotocol; a first wireless power transmission system receiving power ata first power input from the input power supply, the first wirelesspower transmission system including a first transmitter antenna and afirst transfer circuit for driving the first transmitter antenna forwireless power transmission to the first wireless receiver system andwireless receipt of data from the first receiver system, wherein datawirelessly received at the first transmitter antenna from the firstreceiver system at least partially feeds back onto the first powerinput; and a second wireless power transmission system including asecond transmitter antenna and a second transfer circuit for driving thesecond transmitter antenna for wireless power transmission to the secondwireless receiver system, and a low voltage drop out receiving powerfrom the input power supply at V₁ and providing power at a preselectedlower voltage V₂ to the second wireless power transmission system at asecond power input, such that V₂ is independent of data received at thefirst transmitter antenna that is at least partially fed back onto thefirst power input.
 11. The wireless power transfer system of claim 10,wherein the first and second transfer circuits each comprise an H-Bridgeand wherein the data wirelessly received at the first transmitterantenna that at least partially feeds back onto the first power input isfed back by a power input of the H-Bridge associated with the firsttransmitter antenna.
 12. The wireless power transfer system of claim 10,wherein V₁ varies over a range having a lowest value, and wherein thepreselected voltage V₂ is set to remain below the lowest value of therange of V₁.
 13. The wireless power transfer system of claim 10, whereinone or both of the first and second receiver systems includes a poweredload.
 14. The wireless power transfer system of claim 13, wherein theload is an electrical energy storage device.
 15. The dual wireless powertransfer system of claim 10, wherein the first and second wireless powertransmission systems further include respective transmission controllersconfigured to provide respective antenna signals to the respectiveantenna drivers.
 16. The wireless power transfer system of claim 10,wherein the communications signals are coded via amplitude shift keying(ASK).
 17. The wireless transmission system of claim 10, wherein each ofthe first transmission antenna and the second transmission antenna areconfigured to operate based on an operating frequency of about 88-360kHz.
 18. A wireless power transmission system comprising: a power inputconfigured to receive electrical power at a first voltage V₁; a firstwireless power transmission system receiving power from the power input,the first wireless power transmission system including a firsttransmitter antenna and a first transfer circuit for driving the firsttransmitter antenna for wireless power transmission to the firstwireless receiver system and wireless receipt of data from a firstreceiver system, wherein data wirelessly received at the firsttransmitter antenna from the first receiver system at least partiallyfeeds back onto the power input; a second wireless power transmissionsystem including a second transmitter antenna and a second transfercircuit for driving the second transmitter antenna for wireless powertransmission to a second wireless receiver system; and a voltagereduction element receiving power from the power input and providingpower at a voltage lower than that of the power input to the secondwireless power transmission system, wherein the power output by thevoltage reduction element is independent of voltage variations on thepower input.
 19. The wireless power transfer system of claim 18, whereinthe first and second transfer circuits each comprise an H-Bridge. 20.The wireless power transfer system of claim 19, wherein the datawirelessly received at the first transmitter antenna that at leastpartially feeds back onto the first power input is fed back by a powerinput of the H-Bridge.